Patents by Inventor Ramona Damalerio

Ramona Damalerio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and deployable multi-spine apparatus for catheter-based renal denervation
    Patent number: 11234762
    Abstract: A device for vascular denervation comprising a catheter for insertion into a vessel, at least one elongated catheter arm having alternating regions of flexible joints and rigid blocks along the at least one catheter arm, wherein each of the at least one catheter arm comprises at least one tactile sensor and at least one temperature sensor; at least one electrode and electrical circuitry disposed on each of the at least one catheter arm and at least one linkage connected to all of the elongated catheter arms. A method for batch fabricating a plurality of catheter arms for the vascular denervation device is also provided and comprises the steps of depositing a first polymer coating on a semiconductor substrate, forming metal traces on the first polymer coating, patterning and etching the substrate to the first polymer coating to create flexible joint regions.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: February 1, 2022
    Assignees: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH, HANDOK KALOS MEDICAL
    Inventors: Ming-Yuan Cheng, Songsong Zhang, Alex Yuandong Gu, Andrew Benson Randles, Ee Lim Tan, Pushpapraj Singh, Kwan Ling Tan, Weiguo Chen, Ruiqi Lim, Ramona Damalerio, Surasit Chungpaiboonpatana, Eul Joon Park, Jung Soo Oh, Jae Hyung Park, In Hee Bae
  • Sensor patch and sensing device having the same
    Patent number: 10512431
    Abstract: According to embodiments of the present invention, a sensor patch for detecting extravasation is provided. The sensor patch includes an elastic film, and at least one sensing electrode disposed on the elastic film, wherein an electrical resistance of the at least one sensing electrode is changeable in response to a force acting on the at least one sensing electrode. According to further embodiments of the present invention, a sensing device is also provided.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: December 24, 2019
    Assignees: AGENCY FOR SCIENCE, TECHNOLOGY ANO RESEARCH, SINGAPORE HEALTH SERVICES PTE LTD
    Inventors: Ming-yuan Cheng, Cairan He, Swee Kim Tan, Choon Lool Bong, Chee Keong Ho, Ramona Damalerio, Weiguo Chen, Yuandong Gu
  • METHOD AND DEPLOYABLE MULTI-SPINE APPARATUS FOR CATHETER-BASED RENAL DENERVATION
    Publication number: 20180368914
    Abstract: A device for vascular denervation comprising a catheter for insertion into a vessel, at least one elongated catheter arm having alternating regions of flexible joints and rigid blocks along the at least one catheter arm, wherein each of the at least one catheter arm comprises at least one tactile sensor and at least one temperature sensor; at least one electrode and electrical circuitry disposed on each of the at least one catheter arm and at least one linkage connected to all of the elongated catheter arms. A method for batch fabricating a plurality of catheter arms for the vascular denervation device is also provided and comprises the steps of depositing a first polymer coating on a semiconductor substrate, forming metal traces on the first polymer coating, patterning and etching the substrate to the first polymer coating to create flexible joint regions.
    Type: Application
    Filed: December 15, 2016
    Publication date: December 27, 2018
    Inventors: Ming-Yuan CHENG, Songsong ZHANG, Alex Yuandong GU, Andrew Benson RANDLES, Ee Lim TAN, Pushpapraj SINGH, Kwan Ling TAN, Weiguo CHEN, Ruiqi LIM, Ramona DAMALERIO, Surasit CHUNGPAIBOONPATANA
  • SENSOR PATCH AND SENSING DEVICE HAVING THE SAME
    Publication number: 20170367654
    Abstract: According to embodiments of the present invention, a sensor patch for detecting extravasation is provided. The sensor patch includes an elastic film, and at least one sensing electrode disposed on the elastic film, wherein an electrical resistance of the at least one sensing electrode is changeable in response to a force acting on the at least one sensing electrode. According to further embodiments of the present invention, a sensing device is also provided.
    Type: Application
    Filed: December 1, 2015
    Publication date: December 28, 2017
    Inventors: Ming-yuan CHENG, Cairan HE, Swee Kim TAN, Choon Looi BONG, Chee Keong HO, Ramona DAMALERIO, Weiguo CHEN, Yuandong GU
  • Integrated circuit packaging system with leadframe and method of manufacture thereof
    Patent number: 8492887
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a leadframe strip system, having a stress relief slot and a leadframe unit, the stress relief slot is at a frame corner of the leadframe strip system and spans adjacent sides of the leadframe unit, the leadframe unit includes a paddle, a tie bar therefrom, and a lead finger; connecting an integrated circuit and the lead finger; forming an encapsulation covering the integrated circuit; and singulating the integrated circuit in the encapsulation from the leadframe strip system with a package corner of the encapsulation free of micro-cracks with an inspection of the package corner at least 50× view.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: July 23, 2013
    Assignee: STATS ChipPAC Ltd.
    Inventors: Jayby Agno, Erwin Aguas Sangalang, Dexter Anonuevo, Ramona Damalerio
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20110233743
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a leadframe strip system, having a stress relief slot and a leadframe unit, the stress relief slot is at a frame corner of the leadframe strip system and spans adjacent sides of the leadframe unit, the leadframe unit includes a paddle, a tie bar therefrom, and a lead finger; connecting an integrated circuit and the lead finger; forming an encapsulation covering the integrated circuit; and singulating the integrated circuit in the encapsulation from the leadframe strip system with a package corner of the encapsulation free of micro-cracks with an inspection of the package corner at least 50× view.
    Type: Application
    Filed: March 25, 2010
    Publication date: September 29, 2011
    Inventors: Jayby Agno, Erwin Aguas Sangalang, Dexter Anonuevo, Ramona Damalerio