Abstract: Radar device comprising a transmit antenna array comprising a plurality of transmit antennas each having a phase center; and a receive antenna array comprising a plurality of receive antennas each having a phase center, the transmit antennas being arranged such that their phase centers lie on a first straight line, and the receive antennas being arranged such that their phase centers lie on a second straight line; wherein the transmit antenna array and the receive antenna array are positioned relative to each other such that the first straight line and the second straight line extend in an oblique angle relative to each other.

Abstract: A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.

Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

Abstract: Radar device comprising a transmit antenna array comprising a plurality of transmit antennas each having a phase center; and a receive antenna array comprising a plurality of receive antennas each having a phase center, the transmit antennas being arranged such that their phase centers lie on a first straight line, and the receive antennas being arranged such that their phase centers lie on a second straight line; wherein the transmit antenna array and the receive antenna array are positioned relative to each other such that the first straight line and the second straight line extend in an oblique angle relative to each other.

Abstract: A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.

Abstract: A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed. The elements can be integrated by a standard pick and place process.

Abstract: A planar antenna array comprises two or more linear arrays of radiation elements, said linear arrays being substantially arranged in parallel, a first connecting unit connecting first ends of said two or more linear arrays, a second connecting unit connecting second ends of said two or more linear arrays, and a feed port at least at one end of each one of said first and second connecting units for reception of a feed signal.

Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

Abstract: A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed.

Abstract: A planar antenna array comprises two or more linear arrays of radiation elements, said linear arrays being substantially arranged in parallel, a first connecting unit connecting first ends of said two or more linear arrays, a second connecting unit connecting second ends of said two or more linear arrays, and a feed port at least at one end of each one of said first and second connecting units for reception of a feed signal.