Patents by Inventor Ramyashree Vishnuprasad

Ramyashree Vishnuprasad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-zone heater model-based control in semiconductor manufacturing
    Patent number: 11533783
    Abstract: A plurality of heating zones in a substrate support assembly in a chamber is independently controlled. Temperature feedback from a plurality of temperature detectors is provided as a first input to a process control algorithm, which may be a closed-loop algorithm. A second input to the process control algorithm is targeted values of heater temperature for one or more heating zones, as calculated using a model. Targeted values of heater power needed for achieving the targeted values of heater temperature for the one or more heating zones is calculated. Chamber hardware is controlled to match the targeted value of heater temperature that is correlated with the wafer characteristics corresponding to the current optimum values of the one or more process parameters.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: December 20, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Mauro Cimino, Don Channa Kaluarachchi, Son Phi, Ramyashree Vishnuprasad, Dmitry Lubomirsky
  • MULTI-ZONE HEATER MODEL-BASED CONTROL IN SEMICONDUCTOR MANUFACTURING
    Publication number: 20210022212
    Abstract: A plurality of heating zones in a substrate support assembly in a chamber is independently controlled. Temperature feedback from a plurality of temperature detectors is provided as a first input to a process control algorithm, which may be a closed-loop algorithm. A second input to the process control algorithm is targeted values of heater temperature for one or more heating zones, as calculated using a model. Targeted values of heater power needed for achieving the targeted values of heater temperature for the one or more heating zones is calculated. Chamber hardware is controlled to match the targeted value of heater temperature that is correlated with the wafer characteristics corresponding to the current optimum values of the one or more process parameters.
    Type: Application
    Filed: July 18, 2019
    Publication date: January 21, 2021
    Inventors: Mauro Cimino, Don Channa Kaluarachchi, Son Phi, Ramyashree Vishnuprasad, Dmitry Lubomirsky