Abstract: An improved method for measuring contact resistance during device testing is disclosed. After a device under text has been properly positioned to make a contact with a test fixture, a first test current is forced between two pins of the device under test through an isolating diode and the voltage drop associated therewith is measured. Then, a second test current is forced to take the same path and the voltage drop associated therewith is also measured. The values of the forced currents and the measured voltage drops are then used to determine the dynamic resistance of the path, which includes the resistance of two contacts. The determined dynamic resistance or a derivative thereof is then used as an indication of the contact resistance between the test fixture and the device under test.