Abstract: An integrated circuit includes a substrate, an electronic component, a wiring layer, a dielectric bonding layer, a connection pattern, and a barrier layer. The wiring layer is disposed on the substrate, and is electrically connected to the electronic component. The wiring layer includes a metal trace. The dielectric bonding layer is disposed on a side that is of the wiring layer and that is away from the substrate. The connection pattern runs through the dielectric bonding layer, and is electrically connected to the metal trace. The connection pattern includes a seed layer and a conductive block that are stacked, and the seed layer is located on a side that is of the conductive block and that is close to the substrate. The barrier layer is disposed between the conductive block and the dielectric bonding layer, and surrounds a side surface of the conductive block.

Abstract: A memory includes S storage blocks, N global bitlines, and a signal amplification circuit. Each of the S storage blocks is connected to the N global bitlines, the N global bitlines are connected to the signal amplification circuit, the signal amplification circuit is configured to amplify electrical signals on the N global bitlines, and each storage block includes N columns of storage units, N local bitlines, and N bitline switches. In each storage block, storage units in an ith column are connected to an ith local bitline, the ith local bitline is connected to an ith global bitline by using an ith bitline switch in the N bitline switches. A memory array is fine-grained, so that ith local bitlines in the S storage blocks can share one global bitline.

Abstract: A head-mounted display may include a display system and an optical system that are supported by a housing. The optical system may be a catadioptric optical system having one or more lens elements. In one example, the optical system includes a single lens element and a retarder that is coated on a curved surface of the lens element. The retarder may be coated on an aspheric concave surface of the lens element. In another example the retarder may be coated on an aspheric convex surface of the lens element. One or more components of the optical system may be formed using a direct printing technique. This may allow for one or more adhesive layers and one or more hard coatings to be omitted from the optical system. A lens element may be directly printed on the display system to improve alignment between the optical system and the display system.

Abstract: A head-mounted device may include one or more adjustable lens elements. The adjustable lens element may include a transparent substrate, a collapsible wall that forms an enclosed perimeter on the transparent substrate, and a flexible membrane on the collapsible wall that together define an interior volume. The interior volume may be filled with a fluid. The adjustable lens element may include a lens shaping component that applies a force to the collapsible wall to adjust a height of the collapsible wall relative to the transparent substrate, which in turn may be used to adjust the shape of the flexible membrane and thus the lens power of the lens element. The collapsible wall may have bellows that allow the collapsible wall to fold on itself when compressed, thereby minimizing unintended lateral movement of the collapsible wall.

Abstract: A head-mounted display may include a display system and an optical system that are supported by a housing. The optical system may be a catadioptric optical system having one or more lens elements. In one example, the optical system includes a single lens element and a retarder that is coated on a curved surface of the lens element. The retarder may be coated on an aspheric concave surface of the lens element. In another example the retarder may be coated on an aspheric convex surface of the lens element. One or more components of the optical system may be formed using a direct printing technique. This may allow for one or more adhesive layers and one or more hard coatings to be omitted from the optical system. A lens element may be directly printed on the display system to improve alignment between the optical system and the display system.

Abstract: A method for recovering waste lithium battery materials, comprising: (1) performing cell-disassembling on a waste lithium battery to obtain battery powder, ammonia leaching the battery powder to obtain a mixture, and subjecting the mixture to solid-liquid separation to obtain a leached solution and a filter residue; (2) adding a fluorine-phosphorus precipitating agent to the leached solution to obtain a mixture, and subjecting the mixture to solid-liquid separation to obtain a filtrate; (3) subjecting the filtrate to ammonia distillation, subjecting a mixture obtained to solid-liquid separation to obtain a filtrate and a filter residue containing basic copper carbonate and lithium carbonate; (4) washing the filter residue with water, and separating the basic copper carbonate to obtain a washing water; (5) reducing and calcining the filter residue, washing the residue, adding the washing water to the residue to collect lithium by water leaching, and filtering a mixture to obtain a filtrate.

Abstract: The present disclosure belongs to the field of lithium ion battery recovery and discloses a method for selectively recovering valuable metals in waste lithium batteries. The method includes the following steps: adding a sulfur-containing compound to waste lithium battery for calcination and water leaching to obtain lithium carbonate solution and filter residue; adding sulfuric acid and an iron-containing compound to the filter residue for leaching, performing solid-liquid separation, and taking solid phase to obtain manganese dioxide and graphite residue; extracting and reverse extracting liquid phase from the solid-liquid separation to obtain nickel cobalt sulfate solution and manganese sulfate solution. The method of the present disclosure selectively extracts lithium in waste ternary cathode materials by calcination and water leaching, and realizes selective low manganese leaching based on the principle that divalent manganese can reduce the high oxide of nickel and cobalt in the leaching stage.

Abstract: A head-mounted display may include a display system and an optical system that are supported by a housing. The optical system may be a catadioptric optical system having a removable lens element and a non-removable lens element. The optical system may include a quarter wave plate that is coated to the non-removable lens element without an intervening adhesive layer. The optical system may further include a reflective polarizer and a linear polarizer. The removable lens element may be selectively attached to the optical system. The removable lens element may be separated from a non-removable lens element by an air gap when the removable lens element is attached to the optical system. The removable lens element may have a convex curved surface that conforms to a concave curved surface of the non-removable lens element.

Abstract: The invention provide a chip package structure, which includes a first chip and a first hybrid bonding structure. The first chip is connected to another chip through the first hybrid bonding structure. The first hybrid bonding structure includes a first bonding layer. The first bonding layer is disposed on a side away from a substrate of the first chip, and the first bonding layer includes a first insulation material and a plurality of first metal solder pads embedded in the first insulation material. Each of the plurality of first metal solder pads includes a groove structure. A groove bottom of the groove structure is buried in the first insulation material, and a groove opening of the groove structure is exposed to a surface of the first insulation material and is flush with the surface of the first insulation material.

Abstract: Disclosed is a method for purifying a nickel-cobalt-manganese leaching solution.

Abstract: A head-mounted display may include a display system and an optical system that are supported by a housing. The optical system may be a catadioptric optical system having one or more lens elements. The optical system may include a quarter wave plate that is coated to the first lens element without an intervening adhesive layer. The optical system may further include a reflective polarizer and a linear polarizer. The linear polarizer may be formed as a coating directly on the reflective polarizer (without an intervening adhesive). A single circular reflective polarizer may be used instead of a quarter wave plate and a reflective polarizer. The circular reflective polarizer may be coated to the first lens element without an intervening adhesive layer. The circular reflective polarizer may optionally provide optical power to the lens module. The circular reflective polarizer may include a cholesteric liquid crystal layer.

Abstract: A head-mounted display may include a display system and an optical system that are supported by a housing. The optical system may be a catadioptric optical system having one or more lens elements. In one example, the optical system includes a single lens element and a retarder that is coated on a curved surface of the lens element. The retarder may be coated on an aspheric concave surface of the lens element. In another example the retarder may be coated on an aspheric convex surface of the lens element. One or more components of the optical system may be formed using a direct printing technique. This may allow for one or more adhesive layers and one or more hard coatings to be omitted from the optical system. A lens element may be directly printed on the display system to improve alignment between the optical system and the display system.

Abstract: A lens module may include a transparent lens element, a lens shaping structure that is coupled to the transparent lens element, and a plurality of actuators that are configured to adjust a position of the lens shaping structure to adjust the transparent lens element. The lens shaping structure may include a plurality of extensions that are each coupled to a respective actuator. To ensure the lens shaping structure has desired curvature between the extensions, the lens shaping structure may have a portion in one or more segments between adjacent extensions that has a property with a different magnitude than an additional portion of the lens shaping structure. The portion between the adjacent extensions may have an increased or decreased rigidity relative to the additional portions. The portion between the adjacent extensions may have a different width, thickness, or Young's modulus compared to the additional portions.

Abstract: A method for search of light spot positions, includes the following steps: calibrating spatial template distribution of light spots in an object space of a distance measurement system and spatial emission angle factors of the light spots; calculating coordinates of offset light spots on a pixel unit of a collector after impact deformation occurs in the distance measurement system, and obtaining serial numbers of the offset light spots; and according to the coordinates of the offset light spots on the pixel unit of the collector and the serial numbers, calibrating the distance measurement system after the impact deformation occurs to obtain new spatial emission angle factors, and completing the search of light spot positions.

Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.

Abstract: A head-mounted display may include a display system and an optical system that are supported by a housing. The optical system may be a catadioptric optical system having one or more lens elements. In one example, the optical system includes a single lens element and a retarder that is coated on a curved surface of the lens element. The retarder may be coated on an aspheric concave surface of the lens element. In another example the retarder may be coated on an aspheric convex surface of the lens element. One or more components of the optical system may be formed using a direct printing technique. This may allow for one or more adhesive layers and one or more hard coatings to be omitted from the optical system. A lens element may be directly printed on the display system to improve alignment between the optical system and the display system.

Abstract: Disclosed is a method for purifying a nickel-cobalt-manganese leaching solution.

Abstract: Display structures and methods of manufacture of display structure including a display panel with a curved three-dimensional film contour are described. In an embodiment, a display panel includes display area with a main body area and a plurality of petals extending from the main body area. The petals are folded into a curved three-dimensional (3D) film contour, and are separated by corresponding trenches between petals. The trenches may be filled with various seam hiding materials to visually obscure the trenches.

Abstract: An integrated circuit includes: a silicon substrate, and a redistribution layer located on the silicon substrate, where the redistribution layer includes metal routing and a dielectric layer of a first material. An isolation area that runs through the redistribution layer is disposed in the redistribution layer. The isolation area includes a second material. A porosity of the second material is less than a porosity of the first material. A via is disposed inside the isolation area, and the second material surrounds a part of the via. The second material may be a dense material, such that water vapor in the via can be effectively isolated.

Abstract: The technology of this application relates to a semiconductor device that may include a first wafer, a second wafer, and a contact plug. The first wafer may include a first dielectric layer, and the first dielectric layer has a first connection pad. The second wafer is bonded to the first wafer, the second wafer includes a second dielectric layer, and the second dielectric layer has a second connection pad. The contact plug is made of a conductive material filled in a vertical through hole, and is configured to electrically connect the first connection pad and the second connection pad. The vertical through hole is a through hole that is formed through etching and that passes through the first wafer and partially passes through the second wafer to an upper surface and/or a sidewall of the second connection pad.