Abstract: The technology of this application relates to a chip package structure, a production method for a chip package structure, and an electronic device. The chip package structure includes a first connection layer having an upper surface and a lower surface that are opposite to each other, a die disposed on the upper surface of the first connection layer, a first conduction structure disposed on an upper surface of the die, a first plastic package layer covering the die and the first conduction structure, and a rewiring layer disposed on the first plastic package layer. At least a part of the first conduction structure is exposed from an upper surface of the first plastic package layer. The rewiring layer is coupled to the first conduction structure. A signal of the die can be directly led out through the first conduction structure and the rewiring layer.

Abstract: Embodiments of the present application relate to the technical field of computers, and provides a method and an apparatus for node speed limiting, an electronic device and a storage medium. The method comprises: receiving bandwidth data reported by a node under a target domain name, wherein the bandwidth data comprises the number of node connections and a node bandwidth, and the number of node connections is the number of connected devices in the node; and calculating a bandwidth quota for the node based on the bandwidth data and a quota upper limit for the target domain name.

Abstract: The embodiment of the present disclosure provides a back-to-source relationship management system, method, apparatus, server and storage medium.

Abstract: Embodiments of the present application relate to the technical field of computers, and provides a method and an apparatus for node speed limiting, an electronic device and a storage medium. The method comprises: receiving bandwidth data reported by a node under a target domain name, wherein the bandwidth data comprises the number of node connections and a node bandwidth, and the number of node connections is the number of connected devices in the node; and calculating a bandwidth quota for the node based on the bandwidth data and a quota upper limit for the target domain name.

Abstract: A pixel drive circuit, a drive method thereof and a display device are provided. The pixel drive circuit includes a writing sub-circuit, an amplification sub-circuit, and a drive sub-circuit, writing sub-circuit is configured to transmit a data voltage provided by a signal input terminal to the amplification sub-circuit under control of the scan signal terminal; the amplification sub-circuit is configured to generate an amplification electrical signal according to the data voltage and output the amplification electrical signal to a drive sub-circuit, the drive sub-circuit is configured to obtain the data voltage based on the amplification electrical signal output by the amplification sub-circuit and provide a drive current to a light-emitting device under control of the data voltage, and the light-emitting device is configured to emit light according to the drive current output by the drive sub-circuit.

Abstract: A packaging structure and a power amplifier, the packaging structure including a first component, a second component, a printed circuit board, and a metal plate having an etched pattern. The printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot. The first component is disposed in the open slot, and the first component is disposed on the metal plate. The first component is connected to the printed circuit board, the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board.

Abstract: The present application discloses a method for driving a pixel circuit. The method includes initializing a voltage setting in a pixel circuit including at least a driving transistor coupled to a light-emitting device and obtaining a first threshold voltage of the driving transistor. The method further includes inputting a first data voltage to the pixel circuit to generate a first driving current independent of the first threshold voltage, to drive light emission of the light-emitting device in a current cycle. Additionally, the method includes generating a compensation voltage via a feedback sub-circuit based on a change of the first driving current upon a second threshold voltage of the light-emitting device. Furthermore, the method includes inputting a second data voltage combined with the compensation voltage as a negative feedback to generate a second driving current to drive light emission of the light-emitting device in a next cycle.

Abstract: A pixel circuit and driving method thereof, a display device are provided, and the pixel circuit includes a switching sub-circuit, a threshold voltage extraction sub-circuit, an initialization sub-circuit, a feedback compensation sub-circuit, a driving transistor and a light emitting device. The threshold voltage extraction sub-circuit is coupled to a control electrode of the driving transistor, and configured to extract and store a threshold voltage of the driving transistor in response to an enable signal and configured to apply the threshold voltage and a data voltage written by the switching sub-circuit to the control electrode of the driving transistor. The feedback compensation sub-circuit is coupled to a second terminal of the light emitting device and a data line, and configured to generate a data voltage compensation signal for a next display image frame according to an operating current of the light emitting device and supply it to the data line. (FIG. 1).

Abstract: A pixel drive circuit, a drive method thereof and a display device are provided. The pixel drive circuit includes a writing sub-circuit, an amplification sub-circuit, and a drive sub-circuit, writing sub-circuit is configured to transmit a data voltage provided by a signal input terminal to the amplification sub-circuit under control of the scan signal terminal; the amplification sub-circuit is configured to generate an amplification electrical signal according to the data voltage and output the amplification electrical signal to a drive sub-circuit, the drive sub-circuit is configured to obtain the data voltage based on the amplification electrical signal output by the amplification sub-circuit and provide a drive current to a light-emitting device under control of the data voltage, and the light-emitting device is configured to emit light according to the drive current output by the drive sub-circuit.

Abstract: The present application discloses a method for driving a pixel circuit. The method includes initializing a voltage setting in a pixel circuit including at least a driving transistor coupled to a light-emitting device and obtaining a first threshold voltage of the driving transistor. The method further includes inputting a first data voltage to the pixel circuit to generate a first driving current independent of the first threshold voltage, to drive light emission of the light-emitting device in a current cycle. Additionally, the method includes generating a compensation voltage via a feedback sub-circuit based on a change of the first driving current upon a second threshold voltage of the light-emitting device. Furthermore, the method includes inputting a second data voltage combined with the compensation voltage as a negative feedback to generate a second driving current to drive light emission of the light-emitting device in a next cycle.

Abstract: A pixel circuit and driving method thereof, a display device are provided, and the pixel circuit includes a switching sub-circuit, a threshold voltage extraction sub-circuit, an initialization sub-circuit, a feedback compensation sub-circuit, a driving transistor and a light emitting device. The threshold voltage extraction sub-circuit is coupled to a control electrode of the driving transistor, and configured to extract and store a threshold voltage of the driving transistor in response to an enable signal and configured to apply the threshold voltage and a data voltage written by the switching sub-circuit to the control electrode of the driving transistor. The feedback compensation sub-circuit is coupled to a second terminal of the light emitting device and a data line, and configured to generate a data voltage compensation signal for a next display image frame according to an operating current of the light emitting device and supply it to the data line. (FIG. 1).

Abstract: The embodiment of the present disclosure provides a back-to-source relationship management system, method, apparatus, server and storage medium.

Abstract: An embodiment of the present disclosure discloses an over-temperature protection circuitry and a driving method. The circuit includes a source circuit, a comparator circuit and an output circuit, wherein the comparator circuit includes a thermistor, a first resistor and a comparator, the source circuit is connected to a first input terminal of the comparator via the thermistor and is connected to a second input terminal of the comparator via the first resistor; and the comparator circuit is configured to compare a first signal from the first input terminal with a second signal from the second input terminal, and output a control signal according to a comparison result, the control signal is an over-temperature control signal in the case that the comparison result indicates that the temperature is greater than or equal to a protection threshold, and the output circuit is configured to output an disenabling signal.

Abstract: An embodiment of the present disclosure discloses an over-temperature protection circuitry and a driving method. The circuit includes a source circuit, a comparator circuit and an output circuit, wherein the comparator circuit includes a thermistor, a first resistor and a comparator, the source circuit is connected to a first input terminal of the comparator via the thermistor and is connected to a second input terminal of the comparator via the first resistor; and the comparator circuit is configured to compare a first signal from the first input terminal with a second signal from the second input terminal, and output a control signal according to a comparison result, the control signal is an over-temperature control signal in the case that the comparison result indicates that the temperature is greater than or equal to a protection threshold, and the output circuit is configured to output an disenabling signal.

Abstract: The present invention includes a method and apparatus for developing a Rich Internet Application. In one embodiment, there is provided a method for developing a Rich Internet Application, comprising: defining a code space used for a code set, the code set being associated with a view that is to be displayed in the Rich Internet Application; and adjusting the code space so that the adjusted code space is independent of another code space used for another code set, wherein the other code set is associated with another view that is to be displayed in the Rich Internet Application. In one embodiment of the present invention, there is provided an apparatus for developing a Rich Internet Application. By means of the method and apparatus as described in the present invention, conflicts between code sets associated with various views to be displayed in the Rich Internet Application may be isolated.

Abstract: The present invention includes a method and apparatus for developing a Rich Internet Application. In one embodiment, there is provided a method for developing a Rich Internet Application, comprising: defining a code space used for a code set, the code set being associated with a view that is to be displayed in the Rich Internet Application; and adjusting the code space so that the adjusted code space is independent of another code space used for another code set, wherein the other code set is associated with another view that is to be displayed in the Rich Internet Application. In one embodiment of the present invention, there is provided an apparatus for developing a Rich Internet Application. By means of the method and apparatus as described in the present invention, conflicts between code sets associated with various views to be displayed in the Rich Internet Application may be isolated.

Abstract: A method for packaging a quad flat non-leaded (QFN) package body. The method includes: etching an upper surface of a metal plate to process a groove to form a bond wire bench, a component bench, and a bump; processing the bump to a preset height, and assembling a component on the component bench; packaging the processed metal plate to form a package body, and exposing the surface of the processed bump on an upper surface of the package body to form a top lead; and etching a lower surface of the package body to process a bottom lead. In the present invention, large passive components can be stacked on the QFN package body with a top lead; the structure is simplified while the reliability of the welding joints is improved; a plurality of components can be stacked through the top lead to overcome the limitations of component stacking.

Abstract: The present invention discloses a package-on-package structure including a top package and a bottom package from top to bottom, where the bottom package includes a first substrate and a second substrate from top to bottom; a pad is placed on one surface of the first substrate, where the pad is electrically connected to the top package; a chip is placed on the other surface of the first substrate; the second substrate is placed opposite to and below the chip; a first metal terminal is placed at a position that is between the first substrate and the second substrate and bypasses the chip; the first substrate is electrically connected to one surface of the second substrate by using the first metal terminal; and a second metal terminal is placed on the other surface of the second substrate. The present invention is applicable to electronic component packaging.

Abstract: A method for packaging a quad flat non-leaded (QFN) package body. The method includes: etching an upper surface of a metal plate to process a groove to form a bond wire bench, a component bench, and a bump; processing the bump to a preset height, and assembling a component on the component bench; packaging the processed metal plate to form a package body, and exposing the surface of the processed bump on an upper surface of the package body to form a top lead; and etching a lower surface of the package body to process a bottom lead. In the present invention, large passive components can be stacked on the QFN package body with a top lead; the structure is simplified while the reliability of the welding joints is improved; a plurality of components can be stacked through the top lead to overcome the limitations of component stacking.