Abstract: An apparatus for inflating an air bag of a protection device. The apparatus includes a canister including a first compartment and a second compartment. The first compartment is adapted to contain a compressed gas. A seal is between the first compartment and the second compartment which is adapted to seal the compressed gas inside the first compartment. The second compartment includes a two-step mechanism configured to break the seal to cause thereby an initial gas flow from the first compartment into the second compartment. The initial gas flow causes a wide opening in place of the seal to be created for rapid gas flow through the second compartment and into the air bag to rapidly expand the air bag.

Abstract: Detection of a fall of a user wearing the device. A processor is configured to time sample and to input multiple values over time of: the acceleration vector, the angular velocity and the point-to-point distance. The processor is configured to determine over time the direction of gravity from the acceleration vector. The processor is configured to integrate over time the angular velocity to produce an orientation angle of the protection device relative to the direction of gravity. The processor, responsive to the point-to-point distance and the orientational angle, is configured to determine heights over time of the distance sensor from the ground. The processor is configured to indicate initiation of a potential fall event by a change in downward acceleration measured by the accelerometer or a rapid decrease in the determined heights of the distance sensor from the ground.

Abstract: An apparatus for inflating an air bag of a protection device. The apparatus includes a canister including a first compartment and a second compartment. The first compartment is adapted to contain a compressed gas. A seal is between the first compartment and the second compartment which is adapted to seal the compressed gas inside the first compartment. The second compartment includes a two-step mechanism configured to break the seal to cause thereby an initial gas flow from the first compartment into the second compartment. The initial gas flow causes a wide opening in place of the seal to be created for rapid gas flow through the second compartment and into the air bag to rapidly expand the air bag.

Abstract: Detection of a fall of a user wearing the device. A processor is configured to time sample and to input multiple values over time of: the acceleration vector, the angular velocity and the point-to-point distance. The processor is configured to determine over time the direction of gravity from the acceleration vector. The processor is configured to integrate over time the angular velocity to produce an orientation angle of the protection device relative to the direction of gravity. The processor, responsive to the point-to-point distance and the orientational angle, is configured to determine heights over time of the distance sensor from the ground. The processor is configured to indicate initiation of a potential fall event by a change in downward acceleration measured by the accelerometer or a rapid decrease in the determined heights of the distance sensor from the ground.

Abstract: Test samples for use in conducting integrated circuit alpha particle emissions testing, processes for preparing test samples for use in conducting integrated circuit alpha particle emissions testing, and processes for conducting integrated circuit alpha particle emissions testing using the test samples, are described. The approach takes into account the effects of the relative physical positions of the respective components within a final integrated circuit package, and takes into account the effect of contamination of individual components or of the integrated circuit package as a whole due to conditions and/or processes performed during the production process. The described approach relates to test sample preparation and integrated circuit alpha particle emissions testing for integrated circuits in which the alpha particle emission levels are extremely low, i.e., in the ultra low alpha region, for example, alpha particle emissions less than 0.002 cph/cm2.

Abstract: Test samples for use in conducting integrated circuit alpha particle emissions testing, processes for preparing test samples for use in conducting integrated circuit alpha particle emissions testing, and processes for conducting integrated circuit alpha particle emissions testing using the test samples, are described. The approach takes into account the effects of the relative physical positions of the respective components within a final integrated circuit package, and takes into account the effect of contamination of individual components or of the integrated circuit package as a whole due to conditions and/or processes performed during the production process. The described approach relates to test sample preparation and integrated circuit alpha particle emissions testing for integrated circuits in which the alpha particle emission levels are extremely low, i.e., in the ultra low alpha region, for example, alpha particle emissions less than 0.002 cph/cm2.

Abstract: A method for maintaining high availability of an optical wireless data communications link including a first optical terminal and a second optical terminal undergoing free-space communications. A first signal modulated on a first optical carrier is transmitted from the second optical terminal to the first optical terminal. A second signal modulated on a second optical carrier is transmitted from the first optical terminal to the second optical terminal. A first received signal strength of the first signal is monitored and a second received signal strength of the second signal is monitored. Upon detecting the first received signal strength to be less than a previously determined value, the first received signal strength is provided upon request to the second optical terminal by switching off the second signal and encoding the first received signal strength as a second realignment signal onto the second optical carrier. The second optical terminal is realigned based on the second realignment signal.

Abstract: A method for singulating semiconductor wafers comprises the steps of aiming a first and a second laser beam over a top surface of the substrate; forming scribe lines in the coating layer by scanning the first laser beam across the coating layer; and cutting through the substrate along the scribe lines with the second laser beam to form a respective kerf. The apparatus includes a first laser having a first wavelength placed over the coating layer of the substrate, and a second laser having a second wavelength different from that of the first laser placed over a surface of the substrate. The coating layer has a first absorption coefficient relative to a wavelength of the first laser and the semiconductor substrate has a second absorption coefficient less than the first absorption coefficient. Energy from the first laser beam is absorbed into the coating layer to form scribe lines therein, and the second laser beam cuts through the substrate along the scribe lines.

Abstract: A method for laser scribing a semiconductor substrate with coatings on top. The method comprises the steps of focusing a laser beam on a top surface of the substrate coating; absorbing energy from the laser into the coating layer; forming a first set of scribe lines in a first direction on the substrate by scanning the laser beam across the surface of the substrate to evaporate portions of the coating layer; and forming a second set of scribe lines in a second direction on the surface of the substrate substantially orthogonal to the first set of scribe lines to evaporate portions of the layer.

Abstract: A method and apparatus for monitoring wear of a dicing saw blade. The apparatus has a light source to emit light onto an end surface of the saw blade; a sensor for receiving a reflection of a portion of the light from the end surface of the saw blade; and a processor coupled to the sensor for determining wear of the saw blade based on an output from the sensor. The apparatus may also display the wear rate of the saw blade, the present diameter of the saw blade, and/or an estimated time for replacement of the saw blade. The method comprises emitting light onto a cutting edge of the saw blade; receiving a reflection of at least a portion of the light from the edge of the saw blade; and determining wear of the saw blade based on the reflected light.

Abstract: A method and apparatus for singulating semiconductor wafers is described. The method comprises the steps of aiming a laser beam at a layer placed over the substrate; absorbing energy from the laser beam into the layer; forming scribe lines in the layer by scanning the laser beam across the layer; and cutting through the substrate along the scribe lines with a saw blade to singulate the wafer. The apparatus includes a laser placed over the coating layer of the substrate, and a saw blade mounted over a surface of the substrate. The coating layer has a first absorption coefficient relative to a wavelength of the laser and the semiconductor substrate has a second absorption coefficient less than the first absorption coefficient. Energy from the laser beam is absorbed into the coating layer to form scribe lines therein, and the saw blade cuts through the substrate along the scribe lines.

Abstract: A method and apparatus for singulating semiconductor wafers is described. The method comprises the steps of aiming a laser beam at a layer placed over the substrate; absorbing energy from the laser beam into the layer; forming scribe lines in the layer by scanning the laser beam across the layer; and cutting through the substrate along the scribe lines with a saw blade to singulate the wafer. The apparatus includes a laser placed over the coating layer of the substrate, and a saw blade mounted over a surface of the substrate. The coating layer has a first absorption coefficient relative to a wavelength of the laser and the semiconductor substrate has a second absorption coefficient less than the first absorption coefficient. Energy from the laser beam is absorbed into the coating layer to form scribe lines therein, and the saw blade cuts through the substrate along the scribe lines.

Abstract: A method for laser scribing a semiconductor substrate with coatings on top. The method comprises the steps of focusing a laser beam on a top surface of the substrate coating; absorbing energy from the laser into the coating layer; forming a first set of scribe lines in a first direction on the substrate by scanning the laser beam across the surface of the substrate to evaporate portions of the coating layer; and forming a second set of scribe lines in a second direction on the surface of the substrate substantially orthogonal to the first set of scribe lines to evaporate portions of the layer.

Abstract: A method for singulating semiconductor wafers comprises the steps of aiming a first and a second laser beam over a top surface of the substrate; forming scribe lines in the coating layer by scanning the first laser beam across the coating layer; and cutting through the substrate along the scribe lines with the second laser beam to form a respective kerf. The apparatus includes a first laser having a first wavelength placed over the coating layer of the substrate, and a second laser having a second wavelength different from that of the first laser placed over a surface of the substrate. The coating layer has a first absorption coefficient relative to a wavelength of the first laser and the semiconductor substrate has a second absorption coefficient less than the first absorption coefficient. Energy from the first laser beam is absorbed into the coating layer to form scribe lines therein, and the second laser beam cuts through the substrate along the scribe lines.