Abstract: Disclosed is a current sensor. In the current sensor, a primary-side current input copper bar comprises a differential copper bar area and a current shunting copper bar area connected in parallel. The differential copper bar area comprises a current conduction path in a U-shaped structure. The number of the current shunting copper bar area is one or more. Any current shunting copper bar area is placed with the differential copper bar area in a same horizontal plane or in different horizontal plane. The primary-side current input copper bar is integrally formed, or is formed by connecting more than one independent copper bars. A magnetic induction module secured on a circuit board is located above the current conduction path of U-shaped structure in the differential copper bar area. An output of the magnetic induction module forms an output signal of the current sensor.

Abstract: A current detection device with stepped copper bar comprises a circuit board, a magnetic induction module and a stepped copper bar. A magnetic induction module comprises a first magnetic sensing unit, and a second magnetic sensing unit. The side of the stepped copper bar facing the magnetic induction module comprises a first step and a second step, which are different from each other. The first magnetic sensing unit is located above the first step, and the second magnetic sensing unit is located above the second step. A current to be measured flows through the cross section perpendicular to the stepped copper bar. The first magnetic sensing unit and the second magnetic sensing unit sense, in a differential manner, a differential mode magnetic field generated by said current flows through the stepped copper bar; and generate differential voltage signals and output the signal.

Abstract: A method is provided. The method comprises obtaining a first data stream; querying a query table to seek for storage information of a second data stream corresponding to the first data stream in a database, wherein a plurality of second data streams are stored in the database, one or more valid second data streams are included in the plurality of second data streams, and storage information of each of the one or more valid second data streams in the database is included in the query table; and in response to having found in the query table the storage information of the second data stream corresponding to the first data stream in the database, determining, in the database, the second data stream to be spliced with the first data stream based on the storage information of the second data stream.

Abstract: The objective of the present invention is to provide a method, apparatus, computing node and computer program product for fault handling in a stream computing system. Here, at a computing node, recording arrival sequences of respective original data from a upstream computing node; performing persistence operation on the respective original data according to a predetermined period; in the case of failure and restart, restoring to-be-computed data in internal storage from the original data subjected to the persistent operation and/or the upstream computing node, and replaying and computing the restored to-be-computed data according to the respective previous arrival sequences; continuing encoding each completely computed result data according to offset of the result data in the last persistent operation period before the failure and transmitting the encoded result data to a next node.

Abstract: The objective of the present invention is to provide a method, apparatus, computing node and computer program product for fault handling in a stream computing system. Here, at a computing node, recording arrival sequences of respective original data from a upstream computing node; performing persistence operation on the respective original data according to a predetermined period; in the case of failure and restart, restoring to-be-computed data in internal storage from the original data subjected to the persistent operation and/or the upstream computing node, and replaying and computing the restored to-be-computed data according to the respective previous arrival sequences; continuing encoding each completely computed result data according to offset of the result data in the last persistent operation period before the failure and transmitting the encoded result data to a next node.

Abstract: An apparatus for inspection of a surface of a device comprises a projection module operative to project a pattern along a projection axis of the projection module onto the device. An imaging module receives an image of the pattern reflected from the device along an imaging axis of the imaging module onto an image sensor. A lens comprised in the imaging module has a first magnification in a first direction orthogonal to the imaging axis and a second magnification different from the first magnification in a second direction orthogonal to both the first direction and the imaging axis, which produces different fields of view of the image sensor and resolutions of the image in the first and second directions.

Abstract: A method for inspecting a substrate having intrinsic heterogeneous patterns for the presence of cracks comprises the steps of providing an optical device and front-side lighting on a first side of the substrate and providing near-infrared lighting on a second side of the substrate opposite to the first side. The near-infrared lighting is operable to penetrate the substrate so as to be detectable by the optical device through the substrate. One or more images are obtained by illuminating the substrate with the front-side lighting and/or the near-infrared lighting from the second side. The one or more images are thereafter processed to distinguish between the heterogeneous patterns on the substrate and any cracks present on the substrate.

Abstract: A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.

Abstract: An apparatus for inspection of a surface of a device comprises a projection module operative to project a pattern along a projection axis of the projection module onto the device. An imaging module receives an image of the pattern reflected from the device along an imaging axis of the imaging module onto an image sensor. A lens comprised in the imaging module has a first magnification in a first direction orthogonal to the imaging axis and a second magnification different from the first magnification in a second direction orthogonal to both the first direction and the imaging axis, which produces different fields of view of the image sensor and resolutions of the image in the first and second directions.

Abstract: A method for inspecting a substrate having intrinsic heterogeneous patterns for the presence of cracks comprises the steps of providing an optical device and front-side lighting on a first side of the substrate and providing near-infrared lighting on a second side of the substrate opposite to the first side. The near-infrared lighting is operable to penetrate the substrate so as to be detectable by the optical device through the substrate. One or more images are obtained by illuminating the substrate with the front-side lighting and/or the near-infrared lighting from the second side. The one or more images are thereafter processed to distinguish between the heterogeneous patterns on the substrate and any cracks present on the substrate.

Abstract: A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.