Abstract: A rosin composition includes a gum rosin, an emulsifier, and a randomizing additive. The rosin composition may be applied to circuit cards for protection of the circuit card during storage. The rosin composition is solderable and is also easily removed for the soldering of components.

Abstract: A rosin composition includes a gum rosin, an emulsifier, a randomizing additive and a bonding agent. This rosin composition may be used as a temporary or permanent adhesive for the soldering of components. The rosin composition may be temporary as it is easily removed from a surface without damaging the surface.

Abstract: A rosin composition includes a gum rosin, an emulsifier, and a randomizing additive. The rosin composition may be applied to circuit cards for protection of the circuit card during storage. The rosin composition is solderable and is also easily removed for the soldering of components.

Abstract: A rosin composition includes a gum rosin, an emulsifier, a randomizing additive and a bonding agent. This rosin composition may be used as a temporary or permanent adhesive for the soldering of components. The rosin composition may be temporary as it is easily removed from a surface without damaging the surface.

Abstract: In one or more aspects of the present disclosure, a method is disclosed for fabricating a rigid flex cable assembly. The method includes arranging one or more layers of a polyimide film having an electrically-conductive surface into a stack; applying an adhesive to the one or more layers of polyimide film; arranging a top and a bottom polyimide film to a top portion and a bottom portion of the stack to form the rigid flex circuit board; and selecting a suitable pressure and temperature at which to form the rigid flex assembly such that the one or more layers of polyimide film do not move with respect to one another during the fabrication.

Abstract: In one or more aspects of the present disclosure, a method is disclosed for fabricating a rigid flex cable assembly. The method includes arranging one or more layers of a polyimide film having an electrically-conductive surface into a stack; applying an adhesive to the one or more layers of polyimide film; arranging a top and a bottom polyimide film to a top portion and a bottom portion of the stack to form the rigid flex circuit board; and selecting a suitable pressure and temperature at which to form the rigid flex assembly such that the one or more layers of polyimide film do not move with respect to one another during the fabrication.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.

Abstract: In one or more aspects of the present disclosure, a method is disclosed for fabricating a rigid flex cable assembly. The method includes arranging one or more layers of a polyimide film having an electrically-conductive surface into a stack; applying an adhesive to the one or more layers of polyimide film; arranging a top and a bottom polyimide film to a top portion and a bottom portion of the stack to form the rigid flex circuit board; and selecting a suitable pressure and temperature at which to form the rigid flex assembly such that the one or more layers of polyimide film do not move with respect to one another during the fabrication.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.

Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.