Abstract: A method and apparatus is provided for attaching an optical fiber to a waveguide formed on a planar lightguide circuit (PLC). The method begins by securing at least one joint element to a first surface of the PLC. The joint element has a beveled surface such that a gap is formed between the joint element and the first surface of the PLC. The gap is adjacent to an end face of the waveguide. The waveguide end face extends in a plane that includes a transverse surface of the joint element to define therewith a first mating surface. The optical fiber is secured to a support member such that an end face of the optical fiber extends in a plane that includes a transverse surface of the support member to define a second mating surface therewith. The waveguide end face is aligned with the optical fiber end face.

Abstract: An edge emitting laser comprising a substrate with or without a buffer layer having a central mesa disposed thereon, said central mesa having a bottom surface, a top surface and side surfaces and said mesa having an active layer disposed on said substrate with or without a buffer layer, a cladding layer disposed on said active layer, and a quaternary layer disposed on said cladding layer; first and second blocking layers disposed along said sides of said mesa; and at least one alignment fiducial disposed along an outer region of the laser, said alignment fiducial comprising at least a first surface and a second surface, said first surface being a certain distance from said active layer in the y-direction and said second surface being a certain distance from said active layer in the x-direction, said first surface comprising at least a portion of the top of said quaternary layer, said second surface comprising at least a portion of a side of at least one of said quaternary, cladding, or active layers.

Abstract: An optical bidirectional link comprising: a module having a lower surface and an upper surface. The upper surface having disposed thereon a submodule having an optical transmitter and detector mounted thereon. Circuitry mounted on the upper surface. The circuitry having electronic components for effecting bidirectional communication via the optical transmitter and detector. A cover disposed over the upper surface of the module, wherein the submodule further comprises a silicon substrate having an optical fiber disposed in v-groove, a laser, reflective surfaces, and a holographic plate disposed on an upper surface of the silicon substrate.

Abstract: An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.

Abstract: A bi-directional optical link, comprising: a light source for transmitting light at a first wavelength; a photodetector in substantially linear arrangement with the light source for detection of light of a second wavelength; and an optical fiber for carrying light of the second wavelength to the photodetector and for carrying light of the first wavelength from the light source, the optical fiber in substantially linear arrangement with the photodetector and the light source.