Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member. The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.

Abstract: Systems and methods that maintain a vacuum for a long period of time in a portable vacuum chamber are disclosed. Systems and methods for the maintenance of a vacuum in cryogenic Dewars for imaging systems with high gas loads using an integral pump and getter are also disclosed.

Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member. The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.

Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member. The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.

Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member, The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.

Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Abstract: In one embodiment, the present teachings provide for an efficient means to implement bidirectional data and signal channels in optical interconnects. Each optical interconnect channel may include two pairs of emitters and detectors that are imaged onto each other. Many such bidirectional optical channels may be simultaneously interconnected in dense two-dimensional arrays. The send or receive state of each bidirectional optical channel may be directly set in some embodiments by an electronic control signal. In other bidirectional optical channel embodiments, the send/receive state may be controlled locally and autonomously as derived from the output of the local detector.

Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Abstract: Carriers enabling multichip driving of optoelectronic interconnects are disclosed. In one instance, the carriers provide a substantially perpendicular interface between the host circuit board and the optoelectronic die.

Abstract: A driver circuit for driving a light emitting semiconductor device. The driver circuit of this invention includes a capacitor connected between a source of voltage pulses and a light emitting semiconductor device.

Abstract: In one embodiment, the present teachings provide for an efficient means to implement bidirectional data and signal channels in optical interconnects. Each optical interconnect channel may include two pairs of emitters and detectors that are imaged onto each other. Many such bidirectional optical channels may be simultaneously interconnected in dense two-dimensional arrays. The send or receive state of each bidirectional optical channel may be directly set in some embodiments by an electronic control signal. In other bidirectional optical channel embodiments, the send/receive state may be controlled locally and autonomously as derived from the output of the local detector.

Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Abstract: Apparatus and method for implementing a characterized thermal profile upon a temperature/time dependent process on any material or materials susceptible to such thermal processing in accordance with a closed loop environmental feedback system and a corresponding predetermined characterized thermal profile.