Abstract: An integrated suspension for a slider in a magnetic storage system has a simplified structure that is relatively easy to manufacture. The novel integrated suspension may be assembled from separate pieces, including a load beam, a flexure and a mounting plate. The load beam provides rigid structural support of the flexure. The flexure includes a flexible member and leads integrally formed thereon. A section of the flexible member is fixedly attached to the load member, and another section having the slider mounted thereon presses against a pivot projection in the load beam for gimbal motions. An interlocking structure is provided to limit the extent of gimbal motions of the flexible member, comprising a tab extending from the flexible member into an aperture in the load beam. Alternatively, a tang is formed in the flexible member which is used to form a clip which serves to limit gimbal motions as it interacts with the load beam.

Abstract: A transducer suspension system has a transducer head, laminated member, and a load beam. The laminated member is comprised of a support layer, an electrically insulating layer, and an electrically conducting layer. The electrical lines are formed directly into the laminated member. A first end of the support layer has an aperture into which a tongue section protrudes. The transducer head is attached to the tongue section. A platform section is formed between the aperture and the end of the support layer. The electrical lines run to the transducer head along the platform section. The load beam is attached to the laminated member and provides rigid support. The load beam has an aperture located directly above the platform section and provides access to allow clamping of the electrical lines and the platform section during electrical attach of the lines to the transducer head. Precise electrical attachment is achieved without unwanted bending of the delicate flexure section of the suspension.

Abstract: The present invention is an integral magnetic head suspension and method for making the same. The integral suspension, with or without the head, contains integrated conductive circuits that have multiple cross overs for noise reduction. The suspension is fabricated completely on silicon (Si) wafers using semiconductor processes. A N+ silicon layer is disposed over a P- silicon wafer. The N+ silicon layer and the P- silicon water are thermally oxidized to generate a bottom silicon oxide layer opposite the N+ layer side of the wafer and a top silicon oxide layer on the N+ side of the wafer, and to drive the N+ silicon into the P- silicon wafer. A layer of polysilicon is disposed over the silicon oxide layer on top of the N+ silicon layer. One or more pairs of conductive traces having multiple cross-overs are fabricated on the layer of polysilicon. Optimally, a magnetic head is simultaneously fabricated on the suspension.

Abstract: A transducer suspension system has a transducer head, laminated member and a load beam. The laminated member is comprised of a support layer, at least two electrically insulating layers, and at least two electrically conducting layers. The electrical leads are formed directly into the laminated member such that each electrical lead is directly above or below at least one other electrical lead. The overlying leads have noise cancellation similar to that for twisted wire pairs. In addition, by stacking the electrical leads, more electrical leads can be accommodated in the same suspension width.

Abstract: A single layer wear coating is provided for a magnetic head assembly. The single layer is silicon or silicon-based material with a thickness in the range of 30-75 .ANG.. The single layer may be formed by a single step of deposition employing a DC magnetron. The single layer wear coating improves the wear performance of the magnetic head assembly and protects one or more sensitive elements of a magnetic head without significant reduction of spacing loss.

Abstract: The present invention is an integral magnetic head suspension and method for making the same. The integral suspension, with or without the head, contains integrated conductive circuits that have multiple cross overs for noise reduction. The suspension is fabricated completely on silicon (Si) wafers using semiconductor processes. A N+ silicon layer is disposed over a P- silicon wafer. The N+ silicon layer and the P- silicon wafer are thermally oxidized to generate a bottom silicon oxide layer opposite the N+ layer side of the wafer and a top silicon oxide layer on the N+ side of the wafer, and to drive the N+ silicon into the P- silicon wafer. A layer of polysilicon is disposed over the silicon oxide layer on top of the N+ silicon layer. One or more pairs of conductive traces having multiple cross-overs are fabricated on the layer of polysilicon. Optimally, a magnetic head is simultaneously fabricated on the suspension.

Abstract: Disclosed is an improved slider-suspension electrical interconnect assembly and a method of manufacturing the same. The novel integrated suspension may be assembled from separate pieces, including a load beam, a flexure and a mounting plate. The load beam provides rigid structural support of the flexure. The flexure includes a flexible member and conductive leads integrally formed thereon. The flexible member has a gimbal area to which a slider is attached. At least one transducer is attached to the slider for reading data from and writing data to a disk surface. Each of the conductive leads terminates at one end on contact pads on the end face of the slider for electrical connection to the transducer. At the slider termination end, the conductive leads comprise an altered and an unaltered section. The altered section of the conductor has a lower yield strength than the conductor surrounding the altered section, and has a more uniform grain structure than the unaltered section.

Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead.