Abstract: Systems and methods for connecting a circuit board, such as a circuit board of a fan tray, with a chassis are described herein. Systems and methods for floating, aligning, centering, grounding and blind-mating a connector set are also described herein.

Abstract: Systems and methods for connecting a circuit board, such as a circuit board of a fan tray, with a chassis are described herein. Systems and methods for floating, aligning, centering, grounding and blind-mating a connector set are also described herein.

Abstract: A cable management system is disclosed including a frame that can be attached to an equipment rack. Cable guides can be mounted on the frame to align a plurality of cables adjacent to each other. A cable tray is positioned adjacent the cable guides. The combination of the frame, the cable guides, and the cable tray can be positioned alongside a component in the equipment rack to route the cables around an outer edge of the component.

Abstract: An embodiment of a modular electronic enclosure is provided as including a chassis having a first portion defining a first compartment, and a second portion defining a second compartment. First and second replaceable units are replaceably received within the first and second compartments, respectively. The modular electronic enclosure also has a fan unit that is replaceably received within a compartment defined by the first portion or the second portion. The fan unit is configured to pull in cooling air through the first portion and exhaust pressurized cooling air through the second portion. A method of cooling a modular electronic enclosure defining first and second compartments is also provided.

Abstract: An apparatus for receiving cables includes a chassis assembly including a base with a defined opening, and a bulkhead coupled to the base and located adjacent to the defined opening. The bulkhead includes a plurality of apertures capable of receiving an increased number of ports. A method of forming an electronic assembly, includes forming a chassis assembly from a metal sheet. The chassis assembly includes a base with a defined opening. The method further includes forming bulkhead on the base and adjacent to the defined opening. The bulkhead includes a plurality of apertures for receiving ports.

Abstract: A method and apparatus for blind alignment of electronic circuit boards. A receptacle with two vertical flanges and one horizontal flange is positioned relative to an electrical connection. A circuit board having a notch on a leading edge is proximally positioned to the receptacle. As the notched edge is moved toward the receptacle, the flanges guide the board into a registered position relative to the electrical connection. The method and apparatus may be used in any number of alignment situations including those as disparate as robotic assembly operations and assembly by untrained consumers and end-users.

Abstract: A bracket (28) secures a header (12) to a PWB (22) and includes a face plate (32) having an opening (34) sized to receive a portion (33) of the header. The face plate, and header therewith, is secured to the PWB by mounting tabs (44) secured to and extending from the face plate. Each mounting tab is relatively thin and has its narrow-width peripheral edge portion (56) adjacent to the surface (24) of the PWB. The edge portion has an opening (54) sized to accept a rivet (62) to affix the bracket to the PWB. The edge portion contacts a ground pad (66) on the PWB to provide grounding of the PWB through the bracket. The bracket includes centering tabs (48) which engage the edges (62) of the chassis openings (10) to properly position the header in the opening.

Abstract: An electronic assembly includes an electronic module mountable to a backplane having a ground plane for grounding and EMI shielding. The electronic module includes a conductive chassis having a floating chassis board. Interface connectors are mounted to the chassis board and to the backplane and mate with one another when the electronic module engages the backplane. A grounding clip is mounted to the chassis board and is used to engage an alignment pin extending from the backplane. The grounding clip includes a laterally extending resilient arm which grounds the clip to the chassis. The alignment pin is electrically connected to the backplane ground plane and the grounding clip is electrically connected to the chassis board ground plane so that both ground planes are grounded to the chassis through the grounding clip. The backplane includes a ground pad which circumscribes the interface connectors and is connected to the ground plane.

Abstract: A packaging system for components of a computing system includes an external, modularized, ecto-skeletal support frame for supporting a plurality of uniformly, horizontally dimensioned cabinets in stacked arrangement. The support frame is formed from a plurality of support shelves that form the support platforms for the cabinets. Separating and support shelves are support sleeves, that can be of variable lengths in order to accommodate the varying vertical dimensions of the cabinets held by the support frame.

Abstract: An electronic module configured to removably receive a power cord is provided with an interlock mechanism that prevents the power cord from being attached or removed while the module is in a power-on or current-drawing condition. The electronic module includes an on/off switch that, when in its on state, places the electronic module in a power-on condition. A guard mechanism is mounted to the electronic module, proximate the power switch, and is movable from a first position that captures and holds the power cord in connected condition with the electronic module, or prevents connection with the electronic module, to a second position permitting removal or connection of the power cord. Movement of the guard mechanism from the first position to the second position is permitted only if the power switch is in an off state.

Abstract: A system interconnects electronic modules with one another, to a power supply and to signal lines through a printed circuit board. The modules are electrically connected to traces on the printed circuit board using blind mateable connectors. EMI shielding plates are mounted to the circuit board at the I/O connectors for the external cables. Guide elements, such as pin and socket guides and printed circuit board edge guides, are mounted to the circuit board to guide the blind mateable connectors. The syustem eliminates the numerous cables which would otherwise be required. The printed circuit board is mounted within the system housing and acts as an air duct barrier to aid proper air circulation. The circuit board also acts as a structured element helping to stabilize the housing and various module supports and serves as a mounting structure for various elements, such as cooling fans.

Abstract: A system interconnects electronic modules with one another, to a power supply and to signal lines through a printed circuit board. The modules are electrically connected to traces on the printed circuit board using blind mateable connectors. EMI shielding plates are mounted to the circuit board at the I/O connectors for the external cables. Guide elements, such as pin and socket guides and printed circuit board edge guides, are mounted to the circuit board to guide the blind mateable connectors. The system eleminates the numerous cables which would otherwise be required. The printed circuit board is mounted within the system housing and acts as an air duct barrier to aid proper air circulation. The circuit board also acts as a structured element helping to stabilize the housing and various module supports and serves as a mounting structure for various elements, such as cooling fans.

Abstract: An apparatus for controlling the connection of an electrical module to an electrical receptacle. The module is provided with a power switch having a movable switch activator for inhibiting a flow of current to the electrical module when the switch activator is in a first position and for flowing a current to the electrical module when the switch activator is in a second position. The switch activator has a side portion which extends from a surface of the module when the switch activator is in the second position, but which does not extend from the surface of the module when the switch activator is in the first position. A lock member is disposed on a surface of the module and is slidable to a retracted position when the switch activator is in the first position. The lock member extends from the module and abuts against the side portion of the switch activator when the switch activator is in the second position.