Patents by Inventor Randall J. Hartgrove

Randall J. Hartgrove has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated chip to board process
    Patent number: 5113580
    Abstract: The invention encompasses plating to form leads to allow one step bonding of a chip to tape; one step bonding of leads on the tape to a special chip package wherein chip packages may be stacked and connected as well as surface mounted and formation of a very dense circuitry on one or both sides of a board by using a photo imagable dielectric to separate circuitry and allow plating thru to form integral connections and edge connectors to connect circuitry to allow use of both sides of a board.
    Type: Grant
    Filed: November 19, 1990
    Date of Patent: May 19, 1992
    Inventors: Jon M. Schroeder, Joseph F. Long, Randall J. Hartgrove