Patents by Inventor Randall Kemink

Randall Kemink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050199371
    Abstract: A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. The metal base and the solder are cooled and the metal base experiences tensile stresses and the solder experiences compressive stresses to form a concavity in a thermal face of the base. The thermal face is then planed. Over time, the tensile stresses and the compressive stresses reduce such that the thermal face becomes convex.
    Type: Application
    Filed: March 15, 2004
    Publication date: September 15, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Randall Kemink, Prabjit Singh