Abstract: Electronic devices and their formation are described. In one embodiment, a device includes a plurality of stacked semiconductor substrates. The device includes a first semiconductor substrate having a recess extending into a first surface thereof and a via extending from the recess to a second surface opposite the first surface of the first semiconductor substrate. The device also includes a solder positioned in the recess of the first semiconductor substrate. The device also includes an electrically conducting material in the via and electrically coupled to the solder positioned in the recess of the first semiconductor substrate. The device also includes a second semiconductor substrate having bonding pad extending therefrom, the bonding pad electrically coupled to the solder. The device is configured so that at least a portion of the second substrate bonding pad extends a distance into the recess in the first substrate. Other embodiments are described and claimed.