Patents by Inventor Randall Musser

Randall Musser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9841572
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: December 12, 2017
    Assignee: SAMTEC, INC.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Patent number: 9651752
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: May 16, 2017
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Publication number: 20160291274
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: June 14, 2016
    Publication date: October 6, 2016
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Publication number: 20160269118
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: May 18, 2016
    Publication date: September 15, 2016
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Patent number: 9374165
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: June 21, 2016
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Patent number: 8979551
    Abstract: A mezzanine connector includes a first connector including a pass-through hole and a first plurality of contacts arranged around the pass-through hole, the first connector arranged to be connected to a first substrate such that the first plurality of contacts are connected to the first substrate, and a second connector including a beam and a second plurality of contacts arranged around the beam, the second connector arranged to be connected to a second substrate such that the second plurality of contacts are connected to the second substrate. The pass-through hole extends fully through the first connector in a mating direction of the first connector and the second connector, and the beam of the second connector is arranged to extend into the pass-through hole of the first connector when the first connector and the second connector are mated.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: March 17, 2015
    Assignee: Samtec, Inc.
    Inventors: John Mongold, Randall Musser, Brian Vicich
  • Patent number: 8894423
    Abstract: A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: November 25, 2014
    Assignee: Samtec, Inc.
    Inventors: John Mongold, Randall Musser, Brian Vicich, Neal Patterson
  • Publication number: 20140286646
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: June 4, 2014
    Publication date: September 25, 2014
    Applicant: Samtec, Inc.
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Publication number: 20140242817
    Abstract: A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Applicant: SAMTEC, INC.
    Inventors: John MONGOLD, Randall MUSSER, Brian VICICH, Neal PATTERSON
  • Patent number: 8787711
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: July 22, 2014
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Publication number: 20140148022
    Abstract: A mezzanine connector includes a first connector including a pass-through hole and a first plurality of contacts arranged around the pass-through hole, the first connector arranged to be connected to a first substrate such that the first plurality of contacts are connected to the first substrate, and a second connector including a beam and a second plurality of contacts arranged around the beam, the second connector arranged to be connected to a second substrate such that the second plurality of contacts are connected to the second substrate. The pass-through hole extends fully through the first connector in a mating direction of the first connector and the second connector, and the beam of the second connector is arranged to extend into the pass-through hole of the first connector when the first connector and the second connector are mated.
    Type: Application
    Filed: November 29, 2012
    Publication date: May 29, 2014
    Applicant: Samtec, Inc.
    Inventors: John MONGOLD, Randall MUSSER, Brian VICICH
  • Publication number: 20140148058
    Abstract: A compliant pin connector mounting system includes a connector housing, a plurality of contacts each disposed in the connector housing and each including a compliant portion and at least one load bearing surface, and a mounting tool arranged to fit into the connector housing and to contact the at least one load bearing surface of each of the plurality of contacts so as to apply a downward force directly to each of the plurality of contacts. The compliant portion of each of the plurality of contacts is arranged to be aligned with a respective hole in a substrate such that when the downward force is applied directly to the at least one load bearing surface of each of plurality of contacts by the mounting tool, the compliant portion of each of the plurality of contacts is press fit into the respective hole in the substrate.
    Type: Application
    Filed: November 29, 2012
    Publication date: May 29, 2014
    Applicant: Samtec, Inc.
    Inventors: John MONGOLD, Randall MUSSER
  • Patent number: 8727815
    Abstract: A compliant pin connector mounting system includes a connector housing, a plurality of contacts each disposed in the connector housing and each including a compliant portion and at least one load bearing surface, and a mounting tool arranged to fit into the connector housing and to contact the at least one load bearing surface of each of the plurality of contacts so as to apply a downward force directly to each of the plurality of contacts. The compliant portion of each of the plurality of contacts is arranged to be aligned with a respective hole in a substrate such that when the downward force is applied directly to the at least one load bearing surface of each of plurality of contacts by the mounting tool, the compliant portion of each of the plurality of contacts is press fit into the respective hole in the substrate.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: May 20, 2014
    Assignee: Samtec, Inc.
    Inventors: John Mongold, Randall Musser
  • Patent number: 8588561
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: November 19, 2013
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Patent number: 8588562
    Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: November 19, 2013
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Publication number: 20130236186
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: May 16, 2013
    Publication date: September 12, 2013
    Applicant: SAMTEC, INC.
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Publication number: 20130004120
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicant: SAMTEC, INC.
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Patent number: D635518
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: April 5, 2011
    Assignee: Samtec, Inc.
    Inventors: John Mongold, Randall Musser