Abstract: Solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate and at least two electrodes forming an electrode pair. The at least two electrodes may include a first electrode and a second electrode. The first and second electrodes may be offset from each other in a direction substantially parallel to the first surface. The sensing material may be a piezoelectric material and the sensor system may be configured to generate an output signal in response to shear stress experienced by the sensing material.

Abstract: Solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate and at least two electrodes forming an electrode pair. The at least two electrodes may include a first electrode and a second electrode. The first and second electrodes may be offset from each other in a direction substantially parallel to the first surface. The sensing material may be a piezoelectric material and the sensor system may be configured to generate an output signal in response to shear stress experienced by the sensing material.

Abstract: Embodiments of solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate, and at least three electrodes forming a first and second electrode pair. The at least three electrodes may include a first electrode, a second electrode, and a third electrode. The first electrode may be disposed in a first plane and the second electrode and the third electrode may be disposed in a second plane, the first and second planes associated with a first direction parallel to the first surface. The first and second electrodes may be at least partially offset in the first direction. The first and third electrodes may be at least partially offset in the first direction. The sensor system may be configured to generate an output signal in response to a shear stress within the sensing material.

Abstract: Embodiments of solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate, and at least three electrodes forming a first and second electrode pair. The at least three electrodes may include a first electrode, a second electrode, and a third electrode. The first electrode may be disposed in a first plane and the second electrode and the third electrode may be disposed in a second plane, the first and second planes associated with a first direction parallel to the first surface. The first and second electrodes may be at least partially offset in the first direction. The first and third electrodes may be at least partially offset in the first direction. The sensor system may be configured to generate an output signal in response to a shear stress within the sensing material.

Abstract: A synthetic jet ejector (201) is provided which includes a chassis (203); first (205) and second (207) opposing synthetic jet actuators mounted in the chassis; and a controller (209) which controls the first and second synthetic jet actuators and which is in electrical contact with the first and second synthetic jet actuators by way of flexible circuitry (211, 213).

Abstract: A device is provided which includes (a) a thermally conductive base having first and second major surfaces; (b) a die attached to said first major surface of said base; (c) a heat pipe having a first end which is attached to said second major surface of said base; (d) a plurality of heat fins attached to a second end of said heat pipe; and (e) at least one synthetic jet ejector disposed between said base and said plurality of heat fins.

Abstract: A synthetic jet ejector (201) is provided which includes a housing assembly (239, 241) which is equipped with a first plurality of openings (203, 207) and a second plurality of openings (205, 209), and a diaphragm assembly disposed within the housing assembly. The diaphragm assembly includes first (229) and second (243) armatures, a coil (235) disposed between the first and second armatures, first (221) and second (255) end caps, a first diaphragm (223) disposed between the first end cap and the first armature, and a second diaphragm (249) disposed between the second end cap and the second armature. The first and second diaphragms contain a first set of keying features (273) which keys them to the housing assembly. The synthetic jet ejector emits a first plurality of synthetic jets out of the first plurality of openings, and emits a second plurality of synthetic jets out of the second plurality of openings.

Abstract: A thermal management system is provided which comprises (a) a synthetic jet actuator; and (b) a frame having at least one element therein which pressingly engages said synthetic jet actuator.

Abstract: A method is provided for forming tinsel on a synthetic jet actuator. The method comprises (a) providing a synthetic jet actuator assembly (201) comprising a bobbin (203), a voice coil (213), driver electronics (215), and a surround (205); and (b) printing polymer thick film (PTF) conductive ink (209) across the surround, thus connecting the voice coil to the driver electronics.

Abstract: A device (103) is provided which comprises (a) a housing (115) equipped with a viewing window (253); (b) a diaphragm (301), visible through said viewing window; (c) an actuator (126) adapted to vibrate said diaphragm at an operating frequency; and (d) a strobe light (121).

Abstract: A device (103) is provided which comprises (a) a housing (115) equipped with a viewing window (253); (b) a diaphragm (301), visible through said viewing window; (c) an actuator (126) adapted to vibrate said diaphragm at an operating frequency; and (d) a strobe light (121).