Abstract: A vacuum nozzle for a pick and place machine that includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of wood. The tip may also be made of a material that is at least one of polar and porous. Further, a method of picking up and placing a light emitting diode includes providing a pick and place machine having a vacuum nozzle, wherein the vacuum nozzle includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of a material that is at least one of polar and porous. The method includes picking up the light emitting diode and placing the light emitting diode on an electronic assembly.

Abstract: Molded carrier ring-type electrical components are unloaded from a shipping tube by providing the bottom of an escapement mechanism with a substantially flat surface to which the "coin stack" arrangement of components falls during loading of the stack into the escapement. This flat surface presents to the bottom component of the stack an area which is sufficient for preventing dumping of the stack through the escapement and for releveling components which become tilted during loading of the tube into the escapement. The flat surface is biased upwardly by springs and displaceable downwardly against such biasing by a component transfer slide during lateral displacement of the transfer slide to the stack in order to acquire and remove the bottom component from the stack.