Abstract: A method of making a thermally-removable polyurethane material by heating a mixture of a maleimide compound and a furan compound, and introducing alcohol and isocyanate functional groups, where the alcohol group and the isocyanate group reacts to form the urethane linkages and the furan compound and the maleimide compound react to form the thermally weak Diels-Alder adducts that are incorporated into the backbone of the urethane linkages during the formation of the polyurethane material at temperatures from above room temperature to less than approximately 90° C. The polyurethane material can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C. in a polar solvent. The polyurethane material can be used in protecting electronic components that may require subsequent removal of the solid material for component repair, modification or quality control.

Abstract: A method of making a thermally-removable epoxy by mixing a bis(maleimide) compound to a monomeric furan compound containing an oxirane group to form a di-epoxy mixture and then adding a curing agent at temperatures from approximately room temperature to less than approximately 90° C. to form a thermally-removable epoxy. The thermally-removable epoxy can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C. in a polar solvent. The epoxy material can be used in protecting electronic components that may require subsequent removal of the solid material for component repair, modification or quality control.

Abstract: A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90° C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.