Patents by Inventor Randall V. Fraker

Randall V. Fraker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Form board preparation for wire bundling
    Patent number: 11489309
    Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: November 1, 2022
    Assignee: The Boeing Company
    Inventors: Damien O. Martin, Lars E. Blacken, Bradley J. Mitchell, Grace L. Duncan, Eerik J. Helmick, Keith M. Cutler, Randall V. Fraker, Alexey S. Meerov, John R. Porter
  • Form Board Preparation for Wire Bundling
    Publication number: 20210126418
    Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
    Type: Application
    Filed: October 28, 2019
    Publication date: April 29, 2021
    Applicant: The Boeing Company
    Inventors: Damien O. Martin, Lars E. Blacken, Bradley J. Mitchell, Grace L. Duncan, Eerik J. Helmick, Keith M. Cutler, Randall V. Fraker, Alexey S. Meerov, John R. Porter