Patents by Inventor Randolfo Galvez

Randolfo Galvez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • G-tab manufacturing process and the product produced thereby
    Patent number: 5108553
    Abstract: A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made conductive by the electrolytic deposition of a metal on the carbon. The invention is particularly suited for G-TAB wherein a first metal plane is patterned into signal plane circuit traces and a second metal plane is patterned into ground plane traces.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: April 28, 1992
    Assignee: Olin Corporation
    Inventors: Craig A. Foster, Randolfo Galvez, Kurt R. Raab
  • G-TAB having particular through hole
    Patent number: 5065228
    Abstract: A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made conductive by the electrolytic deposition of a metal on the carbon. The invention is particularly suited for G-TAB wherein a first metal plane is patterned into signal plane circuit traces and a second metal plane is patterned into ground plane traces.
    Type: Grant
    Filed: April 4, 1989
    Date of Patent: November 12, 1991
    Assignee: Olin Corporation
    Inventors: Craig A. Foster, Randolfo Galvez, Kurt R. Raab
  • Process for preparing nonconductive substrates
    Patent number: 4994153
    Abstract: Described herein is a process for treating the tooling holes or slots which have been coated with a carbon black dispersion in a nonconductive material which comprises removing said carbon black with an aqueous solution containing:(a) an alkanolamine;(b) an anionic surfactant which is the neutralized addition product of maleic and/or fumaric acid and a poly(oxylated) alcohol;(c) a nonionic surfactant which is an aliphatic mono and/or diphosphate ester; and(d) an alkali or alkaline earth metal hydroxide.
    Type: Grant
    Filed: June 28, 1990
    Date of Patent: February 19, 1991
    Assignee: Olin Corporation
    Inventors: Anthony M. Piano, Randolfo Galvez
  • Process for preparing the through hole walls of a printed wiring board for electroplating
    Patent number: 4897164
    Abstract: In the process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps:(a) contacting said printed wiring board having said through holes with a liquid dispersion of carbon blaock comprised of:(1) carbon black particles having an average particle size of less than about 3.
    Type: Grant
    Filed: April 24, 1989
    Date of Patent: January 30, 1990
    Assignee: Olin Hunt Specialty Products Inc.
    Inventors: Anthony M. Piano, Randolfo Galvez