Patents by Inventor Randolph G. Nichols

Randolph G. Nichols has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Environmentally tuned circuit card assembly and method for manufacturing the same
    Patent number: 7095615
    Abstract: A circuit card assembly and a method for manufacturing the circuit card assembly are disclosed. The circuit card assembly includes a printed wiring board with electronic components bonded thereto. The printed wiring board and electronic components are placed in an outer shell made of lightweight stiff material. The spaces or voids between the outer shell and the printed wiring board and the electronic components are filled with lightweight filling material and thermal filler material. The outer shell and the filling material provide increased rigidity to the electronic components and the thermal filler material increases heat transfer from a given electronic component to outside the circuit card assembly.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: August 22, 2006
    Assignee: Honeywell International, Inc.
    Inventor: Randolph G. Nichols
  • Mounting multichip and single chip modules on printed wiring boards
    Patent number: 5801923
    Abstract: A multichip module is attached to a printed wire circuit board using three conductive mounting feet that are vapor phase soldered to conductive feet on the module's substrate and to conductive feet on the printed wiring circuit board that are connected to a ground plane on the board.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: September 1, 1998
    Assignee: Honeywell Inc.
    Inventor: Randolph G. Nichols