Abstract: A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

Abstract: A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

Abstract: An assembly for transferring heat with respect to one or more components, such as for cooling power electronics, computer processors and other devices. Components may contact heat transfer surfaces which are heated or cooled by a heat transfer fluid. The heat transfer surfaces may be supported by a connecting portion which may allow the heat transfer surfaces to be movable relative to each other.

Abstract: Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.

Abstract: A system and method for deploying a heat harvesting system and for harvesting heat from a geothermal well using one or more heat pipes. A heat exchanger may receive heat from one or more heat pipes for transfer to a heat receiving component. The heat pipes may be thermally coupled to the heat exchanger via a thermal gap material having a relatively low thermal conductivity. A mounting component may engage heat pipes and define a thermal gap between the heat pipes and heat exchanger. A heat spreader, having a relatively high thermal conductivity, may be used to transfer heat from the heat pipes to the thermal gap material and help define a working temperature for the heat pipes. A heat pipe deployment system may include anti-buckling supports and/or a guide to help keep the heat pipes from buckling and to guide the heat pipes into corresponding well bores during deployment.

Abstract: Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.

Abstract: A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states.

Abstract: A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

Abstract: A torsion bar clamp device and method for mounting a heat sink to an electronic component comprising a torsion bar having a longitudinally extending bar and at least one integral lever adapted to engage a heat sink and mounting legs which couple forces imparted by the torsion bar to the heat sink and electronic component such that the heat sink and electronic component are compressively coupled. The invention may be manufactured of injection molded plastic and may be adapted to allow the mounting legs to engage bosses on a socket in which an electronic component is mounted.

Abstract: A torsion bar clamp device and method for mounting a heat sink to an electronic component comprising a torsion bar having a longitudinally extending bar and at least one integral lever adapted to engage a heat sink and mounting legs which couple forces imparted by the torsion bar to the heat sink and electronic component such that the heat sink and electronic component are compressively coupled. The invention may be manufactured of injection molded plastic and may be adapted to allow the mounting legs to engage bosses on a socket in which an electronic component is mounted.

Abstract: A reverse cantilever spring clip for providing intimate thermal contact between a heat sink and a heat generating electrical component such as an integrated circuit (IC). The spring clip includes a spring member and a retention member. The retention member has one or more legs with a securing member affixed to an outer end of the legs. The legs are configured for engaging a heat sink and a circuit board to which the IC is mounted so that the heat sink is positioned directly over the circuit board. The securing member maintains contact between the IC and heat sink.

Abstract: A torsion bar clamp device and method for mounting a heat sink to an electronic component comprising a torsion bar having a longitudinally extending bar and at least one integral lever adapted to engage a heat sink and mounting legs which couple forces imparted by the torsion bar to the heat sink and electronic component such that the heat sink and electronic component are compressively coupled. The invention may be manufactured of injection molded plastic and may be adapted to allow the mounting legs to engage bosses on a socket in which an electronic component is mounted.

Abstract: A spring clamp device providing a compressive stress to a stack of components includes a spring member and a bracket having attachment structure for engaging mating structure near the bottom of the stack. The bracket is first engaged with the mating structure such that it straddles the stack. The spring member is then latched to the bracket under tension in an assembled configuration, thereby applying an upward reaction on the mating structure with the attachment structure of the bracket and applying a downward reaction force to the top of the stack with the spring member. The oppositely directed forces apply a compressive stress to the stack, which improves thermal contact between the components.