Patents by Inventor Randolph M. Parrish

Randolph M. Parrish has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer material and related methods
    Patent number: 8247063
    Abstract: A material and related methods that include a first layer and a second layer that is coupled to the first layer with the first layer disposed on the second layer, and an interface between the first layer and the second layer. The interface is configured to allow the first layer to be separated from the second layer. The first layer, after separation from the second layer, is configured to be repositioned and re-coupled to the second layer.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: August 21, 2012
    Assignee: Avery Dennison Corporation
    Inventors: Victor P. Holbert, Randolph M. Parrish, Kevin O. Henderson, Ronald F. Sieloff
  • MULTILAYER MATERIAL AND RELATED METHODS
    Publication number: 20110003096
    Abstract: A material and related methods that include a first layer and a second layer that is coupled to the first layer with the first layer disposed on the second layer, and an interface between the first layer and the second layer. The interface is configured to allow the first layer to be separated from the second layer. The first layer, after separation from the second layer, is configured to be repositioned and re-coupled to the second layer.
    Type: Application
    Filed: March 27, 2009
    Publication date: January 6, 2011
    Applicant: AVERY DENNISON CORPORATION
    Inventors: Victor P. Holbert, Randolph M. Parrish, Kevin O. Henderson, Ronald F. Sieloff