Abstract: Apparatuses and methods for high speed bonding for an RFID device are provided. A first substrate includes an antenna and is coupled to a strap assembly by an adhesive material. The adhesive material is substantially inert thermally for a predetermined temperature range, or it otherwise lacks a heat flow variation greater than 0.05 W/g for the predetermined temperature range. Such an adhesive material provides a reliable bond. In a specific embodiment, the predetermined temperature range is about 30° Celsius to about 85° Celsius. In an alternative embodiment, the adhesive material can be exposed to water or steam to reduce its heat flow variation to less than 0.05 W/g for the temperature range.

Abstract: Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

Abstract: Techniques for an RFID article in roll format are provided. The RFID article includes a plurality of inlays on a flexible substrate. The inlays including integrated circuits coupled to antennas. The RFID article further includes at least one interleaf that is disposed to one side of integrated circuits of the inlays. In specific embodiments, the RFID article includes two interleafs disposed on opposite sides of the integrated circuits.

Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

Abstract: A flexible electronic, Radio Frequency Identification (RF ID) or display device and methods of making the same. The flexible electronic, Radio Frequency Identification (RF ID) or display device comprises a flexible substrate having a top surface and a bottom surface. The top surface comprises electrical components. The flexible substrate comprises openings cutting therethrough from the top surface to the bottom surface. A conductive layer is coupled to the flexible substrate wherein the openings expose at least a portion of the conductive layer. The openings are filled with conductive elements to make first electrical contacts to at least a portion of the conductive layer and second electrical contacts to the electrical components on the flexible substrate.

Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

Abstract: A flexible electronic, Radio Frequency Identification (RF ID) or display device and methods of making the same. The flexible electronic, Radio Frequency Identification (RF ID) or display device comprises a flexible substrate having a top surface and a bottom surface. The top surface comprises electrical components. The flexible substrate comprises openings cutting therethrough from the top surface to the bottom surface. A conductive layer is coupled to the flexible substrate wherein the openings expose at least a portion of the conductive layer. The openings are filled with conductive elements to make first electrical contacts to at least a portion of the conductive layer and second electrical contacts to the electrical components on the flexible substrate.