Patents by Inventor Randy C. Day

Randy C. Day has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7924895
    Abstract: A monolithic pumped laser cavity design is disclosed. Elements of the laser cavity, such as gain material, Q-switch, reflector, and outcoupler, are contact bonded together with a thermally conductive epoxy. The assembly is then operatively coupled to a heat sink (e.g., by mechanical or chemical means). The assembly is potted in thermally conductive potting material. The stacked elements or a subset thereof may be bonded to heat sink mounts and/or face cooling layers. In this fashion, various elements can be easily assembled and bonded together to provide the desired combination of laser energy, pulse width, and repetition frequency. The thermally conductive potting material provides structural integrity, as well as thermal management by extracting heat from the encased assembly to the heat sink. The optional heat sink mounts and face cooling operate to further extract heat and reduce thermal loading. Outcoupling to fiber may also be provided.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: April 12, 2011
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John C. McCarthy, Randy C. Day, Robert J. Grasso, York E. Young
  • Publication number: 20080291948
    Abstract: A monolithic pumped laser cavity design is disclosed. Elements of the laser cavity, such as gain material, Q-switch, reflector, and outcoupler, are contact bonded together with a thermally conductive epoxy. The assembly is then operatively coupled to a heat sink (e.g., by mechanical or chemical means). The assembly is potted in thermally conductive potting material. The stacked elements or a subset thereof may be bonded to heat sink mounts and/or face cooling layers. In this fashion, various elements can be easily assembled and bonded together to provide the desired combination of laser energy, pulse width, and repetition frequency. The thermally conductive potting material provides structural integrity, as well as thermal management by extracting heat from the encased assembly to the heat sink. The optional heat sink mounts and face cooling operate to further extract heat and reduce thermal loading. Outcoupling to fiber may also be provided.
    Type: Application
    Filed: May 23, 2007
    Publication date: November 27, 2008
    Inventors: John C. McCarthy, Randy C. Day, Robert J. Grasso, York E. Young