Patents by Inventor Randy C. Long

Randy C. Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6019270
    Abstract: A soldering iron tip includes a removable Invar shield covering a copper core plated with other metals. In one embodiment, the core is plated with iron and, outside a working section of the tip, with nickel and chrome. In another embodiment, the core is plated with chrome.
    Type: Grant
    Filed: June 11, 1996
    Date of Patent: February 1, 2000
    Assignee: Lockheed Martin Corporation
    Inventors: Stephen E. Boll, James Kenneth Lake, Randy C. Long, Peter Michael Ziolkowski
  • Patent number: 5414303
    Abstract: Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.
    Type: Grant
    Filed: March 2, 1994
    Date of Patent: May 9, 1995
    Assignee: IBM Corporation
    Inventors: Stephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild
  • Patent number: 5411703
    Abstract: A high solidus temperature, high service temperature, high strength multi-component solder alloy having a major portion of Sn and effective amounts of Sb, Bi and Cu.
    Type: Grant
    Filed: June 16, 1993
    Date of Patent: May 2, 1995
    Assignee: International Business Machines Corporation
    Inventors: Stephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild
  • Patent number: 5393489
    Abstract: Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi.
    Type: Grant
    Filed: June 16, 1993
    Date of Patent: February 28, 1995
    Assignee: International Business Machines Corporation
    Inventors: Stephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild
  • Patent number: 5368814
    Abstract: The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component. The third component can be Cu, In, Ag, and combinations of Cu and Ag.
    Type: Grant
    Filed: June 16, 1993
    Date of Patent: November 29, 1994
    Assignee: International Business Machines, Inc.
    Inventors: Stephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild
  • Patent number: 5344607
    Abstract: Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.
    Type: Grant
    Filed: June 16, 1993
    Date of Patent: September 6, 1994
    Assignee: International Business Machines Corporation
    Inventors: Stephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild
  • Patent number: 5328660
    Abstract: Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.
    Type: Grant
    Filed: June 16, 1993
    Date of Patent: July 12, 1994
    Assignee: International Business Machines Corporation
    Inventors: Stephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild