Patents by Inventor Randy Claude Stevenson

Randy Claude Stevenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6000597
    Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: December 14, 1999
    Assignee: Ford Motor Company
    Inventors: Marc Alan Straub, Frank Burke DiPiazza, Vivek Amir Jairazbhoy, Lakhi Nandial Goenka, Randy Claude Stevenson
  • Patent number: 5820772
    Abstract: A solder pump includes a pump body having a solder reservoir and pump chamber formed therein in fluid communication with each other. A nozzle portion is provided in communication with the pump chamber for dispensing solder. A thin movable diaphragm is positioned adjacent the pump chamber and movable into the pump chamber for selectively pressurizing solder in the pump chamber for dispensing solder through the nozzle portion. A diaphragm clamp is secured to the body for supporting the diaphragm. The clamp includes an internal channel extending therein and enclosed by the diaphragm. The channel is provided in communication with a source of pressurized air for selectively forcing the diaphragm into the pump chamber. An adjustable stop is positioned within the pump chamber adjacent the diaphragm for limiting movement of the diaphragm into the pump chamber.
    Type: Grant
    Filed: January 21, 1997
    Date of Patent: October 13, 1998
    Assignee: Ford Motor Company
    Inventors: Otto Wilhelm Freitag, Randy Claude Stevenson, Keith Wade Meranda
  • Patent number: 5746368
    Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: May 5, 1998
    Assignee: Ford Motor Company
    Inventors: Marc Alan Straub, Frank Burke DiPiazza, Vivek Amir Jairazbhoy, Lakhi Nandial Goenka, Randy Claude Stevenson