Patents by Inventor Randy Crockett

Randy Crockett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11903134
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: February 13, 2024
    Assignee: JABIL INC.
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Publication number: 20230363128
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 9, 2023
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Patent number: 11785754
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: October 10, 2023
    Assignee: JABIL INC.
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Patent number: 11485090
    Abstract: An apparatus, a system, and a method for improvements in fused filament fabrication (FFF). Characteristics of a filament may be measured during production of the filament and the characteristics stored in a memory for retrieval by a 3D printer. The 3D printer adjusts print settings as necessary based on the measured characteristics, thereby resulting in better print quality.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: November 1, 2022
    Assignee: JABIL INC.
    Inventors: Scott Klimczak, Darin Burgess, Randy Crockett
  • Patent number: 11477926
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: October 18, 2022
    Assignee: JABIL INC.
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Publication number: 20220322587
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Publication number: 20220279689
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Application
    Filed: May 18, 2022
    Publication date: September 1, 2022
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Publication number: 20220227060
    Abstract: An apparatus, a system, and a method for improvements in fused filament fabrication (FFF). Characteristics of a filament may be measured during production of the filament and the characteristics stored in a memory for retrieval by a 3D printer. The 3D printer adjusts print settings as necessary based on the measured characteristics, thereby resulting in better print quality.
    Type: Application
    Filed: April 7, 2022
    Publication date: July 21, 2022
    Inventors: Scott Klimczak, Darin Burgess, Randy Crockett
  • Publication number: 20220072794
    Abstract: An apparatus, a system, and a method for improvements in fused filament fabrication (FFF). Characteristics of a filament may be measured during production of the filament and the characteristics stored in a memory for retrieval by a 3D printer. The 3D printer adjusts print settings as necessary based on the measured characteristics, thereby resulting in better print quality.
    Type: Application
    Filed: September 4, 2020
    Publication date: March 10, 2022
    Inventors: Scott Klimczak, Darin Burgess, Randy Crockett
  • Publication number: 20220078955
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Application
    Filed: September 9, 2020
    Publication date: March 10, 2022
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Publication number: 20100126025
    Abstract: A lopper of use by those who, for one reason or the other, find it difficult to bend over sufficiently to cut unwanted plant material at or near ground level. The lopper has a jaw which is parallel to the ground with the user standing and the user is able to anchor one of the blades of the lopper while manipulating the other blade toward and away from the anchored blade to cut plant material between them at or near ground level.
    Type: Application
    Filed: November 21, 2008
    Publication date: May 27, 2010
    Inventors: Randy Crockett, Deanne Crockett