Patents by Inventor Randy E. Haslow

Randy E. Haslow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing vias for subsequent metallization
    Patent number: 5833759
    Abstract: The invention relates to a method for cleaning vias in electronic component substrates prior to metallization thereof.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: November 10, 1998
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: Randy E. Haslow, Donald G. Hutchins, Michael R. Leaf
  • Method for selectively plating an organic substrate
    Patent number: 5779921
    Abstract: The present invention relates to a process for metallizing features of an electronic component, where the metallized features, conductive pads, conductive traces, are coated and encapsulated with at least one metal layer and the features on the front side and the back side of the component have different thicknesses
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: July 14, 1998
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: Randy E. Haslow, Donald G. Hutchins, Michael R. Leaf