Abstract: Embodiments of the present disclosure relate to a cobalt-boron (CoB) layer for magnetic recording devices, memory devices, and storage devices. In one or more embodiments, the CoB layer is part of a spin-orbit torque (SOT) device. In one or more embodiments, the SOT device is part of an SOT based sensor, an SOT based writer, a memory device (such as a magnetoresistive random-access memory (MRAM) device), and/or a storage device (such as a hard disk drive (HDD) or a tape drive). In one embodiment, an SOT device includes a seed layer, and a cap layer spaced from the seed layer. The SOT device includes a spin-orbit torque (SOT) layer, and a nano layer (NL) between the seed layer and the cap layer. The SOT device includes a cobalt-boron (CoB) layer between the seed layer and the cap layer, and the CoB layer is ferromagnetic.

Abstract: The present disclosure generally relates to spin-orbit torque (SOT) devices comprising a bismuth antimony (BiSb) layer. The SOT devices further comprises a nonmagnetic buffer layer, a nonmagnetic interlayer, a ferromagnetic layer, and a nonmagnetic barrier layer. One or more of the barrier layer, interlayer, and buffer layer comprise a polycrystalline non-Heusler alloy material, or a Heusler alloy and a material selected from the group consisting of: Cu, Ag, Ge, Mn, Ni, Co, Mo, W, Sn, B, and In. The Heusler alloy is a full Heusler alloy comprising X2YZ or a half Heusler alloy comprising XYZ, where X is one of: Mn, Fe, Co, Ni, Cu, Ru, Rh, Pd, Ag, Ir, Pt, and Au, Y is one of: Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Y, Zr, Nb, Mo, Hf, and W, and Z is one of: B, Al, Si, Ga, Ge, As, In, Sn, Sb, and Bi.

Abstract: The present disclosure generally relates to spin-orbit torque (SOT) device comprising a first bismuth antimony (BiSb) layer having a (001) orientation. The SOT device comprises a first BiSb layer having a (001) orientation and a second BiSb layer having a (012) orientation. The first BiSb layer having a (001) orientation is formed by depositing an amorphous material selected from the group consisting of: B, Al, Si, SiN, Mg, Ti, Sc, V, Cr, Mn, Y, Zr, Nb, AlN, C, Ge, and combinations thereof, on a substrate, exposing the amorphous material to form an amorphous oxide surface on the amorphous material, and depositing the first BiSb layer on the amorphous oxide surface. By utilizing a first BiSb layer having a (001) orientation and a second BiSb having a (012) orientation, the signal through the SOT device is balanced and optimized to match through both the first and second BiSb layers.

Abstract: The present disclosure generally relates to spin-orbit torque (SOT) devices comprising a bismuth antimony (BiSb) layer. The SOT devices further comprise one or more GexNiFe layers, where at least one GexNiFe layer is disposed in contact with the BiSb layer. The GexNiFe layer has a thickness less than or equal to about 15 ? when used as an interlayer on top of the BiSb layer or less than or equal to 40 ? when used as a buffer layer underneath the BiSb. When the BiSb layer is doped with a dopant comprising a gas, a metal, a non-metal, or a ceramic material, the GexNiFe layer promotes the BiSb layer to have a (012) orientation. When the BiSb layer is undoped, the GexNiFe layer promotes the BiSb layer to have a (001) orientation. Utilizing the GexNiFe layer allows the crystal orientation of the BiSb layer to be selected.

Abstract: The present disclosure generally relates to spin-orbit torque (SOT) magnetic tunnel junction (MTJ) devices comprising a doped bismuth antimony (BiSbE) layer having a (012) orientation. The devices may include magnetic write heads, read heads, or MRAM devices. The dopant in the BiSbE layer enhances the (012) orientation. The BiSbE layer may be formed on a texturing layer to ensure the (012) orientation, and a migration barrier may be formed over the BiSbE layer to ensure the antimony does not migrate through the structure and contaminate other layers. A buffer layer and interlayer may also be present. The buffer layer and the interlayer may each independently be a single layer of material or a multilayer of material. The buffer layer and the interlayer inhibit antimony (Sb) migration within the doped BiSbE layer and enhance uniformity of the doped BiSbE layer while further promoting the (012) orientation of the doped BiSbE layer.

Abstract: A stacked jack modular jack assembly is comprised of a multi-port housing including a plurality of jack subassemblies. The jack subassemblies include upper and lower jack housings sandwiching therebetween, a cross-talk shield. The terminal subassembly is substantially Z-shaped, which allows for increased space therebelow for signal conditioning components. The terminal module also includes a center shield and a lower shield, and an outer shield, all of which are commoned together and grounded.

Abstract: A stack jack modular jack assembly is comprised of a multi-port housing, and a plurality of modular jack subassemblies. The jack subassemblies include upper and lower jack housing sandwiching therebetween, a cross-talk shield. The terminal subassembly is substantially Z-shaped, which allows for increased space there below for signal conditioning components. The terminal module also includes a center shield and a lower shield, and an outer shield, all of which are commoned together and grounded. An outer shield substantially surrounds the entire assembly, and is commoned to the other shield members.

Abstract: A stacked jack modular jack assembly is comprised of a multi-port housing. The housing includes LEDs for each port to monitor the condition of the signals. The upper port LEDs are mounted on LED modules, which are aligned with the housing. These modules also form the housing side walls for the receipt and alignment for jack subassemblies. The jack subassembly modules are pluggable into the multi-port housing to provide for the connector interface.

Abstract: A plug and receptacle assembly comprises a plug connector and receptacle connector, for high-density interconnections of data cable. The plug connector is comprised of two hermaphroditic housings which both include two rows of electrical terminals. The contact portions of the terminals are disposed on opposite sides of a front cantilevered section, whereas wire connecting sections extend through the rear of the housings and are adapted to receive the wires in a soldering operation. The housings are positioned in a shielding shell when fully terminated to fully shield the connector assembly.

Abstract: A plug and receptacle assembly comprises a plug connector and receptacle connector, for high-density interconnections of data cable. The two connectors are fully shielded and include a mating profile including a modified D-shaped configuration where one end of the shroud includes a concave radiused portion and two jackscrews or threaded inserts are located within the area formed by the concave radiused portion. In this manner, the entire width of the connector assembly is reduced for high-density interconnections.

Abstract: A plug and receptacle assembly comprises a plug connector and receptacle connector, for high-density interconnections of data cable. The plug connector is comprised of two hermaphroditic housings which both include two rows of electrical terminals. The contact portions of the terminals are disposed on opposite sides of a front cantilevered section, whereas wire connecting sections extend through the rear of the housings and are adapted to receive the wires in a soldering operation. The housings are positioned in a shielding shell when fully terminated to fully shield the connector assembly.

Abstract: A plug and receptacle assembly comprises a plug connector and receptacle connector, for high-density interconnections of data cable. The two connectors are fully shielded and include a mating profile including a modified D-shaped configuration where one end of the shroud includes a concave radiused portion and two jackscrews or threaded inserts are located within the area formed by the concave radiused portion. In this manner, the entire width of the connector assembly is reduced for high-density interconnections.

Abstract: An electrical connector includes a housing having a cavity which holds a pair of terminal inserts. Each of the terminal inserts includes a respective molding which holds a respective plurality of terminals. The moldings have respective latch arms which latchably secure the terminal inserts together to form a terminal insert subassembly which is inserted into the cavity as a unit. The latch arms have latch tabs which are cooperable with the housing to secure the terminal insert subassembly in the housing. The terminals in one of the terminal inserts are laterally staggered with respect to the terminals in the other of the terminal inserts.

Abstract: This invention is directed too a PCMCIA frame kit having improved stability, where the kit is intended to receive a planar electronic device for electrical engagement with a complementary device in electronic equipment. The kit comprises a pair of matable, metal cover members, where each cover member is integrally molded to a dielectric frame upon which the planar electronic device is seated. The improved feature is the provision of each frame including at least a pair of side rails, where at least one side rail pair on one cover member includes plural, circular, upstanding pins having a predetermined diameter, the matable side rail on the other cover member includes a like plurality of holes to receive a corresponding pin.

Abstract: This invention is directed to an improved PCMCIA frame kit for receiving a planar electronic device, such as a printed circuit board or memory card, for electrical engagement with a complementary device in electronic equipment, such as a computer. The kit comprises a pair of matable, cover members to provide shielding to the planar electronic device, and that each cover member is integrally molded to a dielectric frame upon which the planar electronic device is seated. The improvement hereof lies in the provision of each frame including a dielectric extension intermatable with one another to define a cavity for receiving a portion of the planar electronic device. By this arrangement the planar electronic device may be provided with an antenna for the transmission of signals through the dielectric extension. Optionally, the cover members and extensions may be essentially identical in construction having appropriate means about the periphery thereof, for intermatability.

Abstract: This invention relates to a high density shielded electrical cable connector receptacle of the type for the transmission of signals from PCMCIA cards to network wiring. The receptacle comprises a housing insert for mounting a plurality of electrical contacts, a pair of hermaphroditic, metal shielding members adapted to lie contiguous with the housing insert, and a dielectric cover member for receiving the assembled housing insert and shielding members. The housing insert comprises a dielectric, elongated, first housing member having a connector mating portion, and a rear insert receiving portion, and a dielectric insert for receipt in the insert receiving portion.

Abstract: This invention is directed to a fully shielded printed circuit (PC) card holder, that may be readily "snapped" into the assembly, or disassembled, as the case may be. The holder is intended to receive a PC card, where at least one end of the card is adapted to be electrically connected to an I/O type connector. The holder comprises a generally rectangular bottom cover member formed of a conductive material, corner supports integrally molded to the bottom cover member at the respective corners thereof, where each support includes a lower flange portion to which the bottom cover member is exposed. Further, a generally rectangular upper cover member is provided where the periphery thereof includes a downwardly extending flange adapted to engage the lower flange portion in electrical contact with the bottom cover member over a substantial portion of the periphery thereof.

Abstract: An outlet (1) or communications cable (17), includes, an enclosure (2) defined by a base (3) and a cover (4), a cable receiving opening (8) in the base (3), multiple interchangeable plates (5) adapted for removable mounting along sides (23) of the enclosure (2), and each of the plates (5) being removable for replacement by one of the plates (5) having a connector receiving opening (6) adapted to receive a data connector (20) connected to a cable (17) received by the cable receiving opening (8).

Abstract: A multicontact electrical connector (2) comprises an insulating housing (4) defining a plurality of pairs of adjacent rows of contact receiving cavities (18 and 20). In the upper cavity (18) of the middle row of superposed pairs of cavities (18 and 20) is a shorter contact element (38), a longer contact element (36) being supported in the cavity (20) immediately therebelow. Each longer contact element (36) has a bowed contact surface (42) which is nearer to the mating face (12) the housing (4) than the bowed contact surface (42) of the shorter contact element (38). The contact surfaces (42) of the contact elements (36 and 38) lie in slots (6,8,10) for receiving respective contact members (74,76,78) of a mating connector (66).

Abstract: A method of plating a flexible plastic part is disclosed where serrations are provided on a flexible beam where the serrations are sinuous in shape. After molding the serrations onto the flexible beam, the component is electrically dipped to plate the component. The flexible beam can now be flexed without concern of cracking the plating along the length of the beam where the beam is flexed. A second embodiment shows an outlet box including two latch members along the sides which are bow shaped and have grounding surfaces thereon, which latch the outlet box in place to a panel, and simultaneously ground the box to the panel.