Abstract: An electric drive system is provided where the inverter may be integrated within the motor. The electric drive system may include an outer rotor and an inner stator, where the inner stator includes an interior space in which circuitry for the electric drive system may be provided.

Abstract: Embodiments of the disclosure provide an electric drive motor system that includes a stationary-side, a rotating-side, and a stationary-side sensor system operable to detect current on the stationary-side and send current-based sensor readings to a controller. The stationary-side further includes a compensation network. The controller is operable to perform a rotor current prediction operation operable to predict a rotor current associated with a rotor of the rotating-side based at least in part on the current-based sensor readings and a parameter of at least one component of the compensation network of the stationary-side.

Abstract: Embodiments of the disclosure provide an electric drive motor system that includes a stationary-side, a rotating-side, and a first mounting and communications structure on the rotating-side. A secondary is winding physically coupled to the first mounting and communications structure. A rectifier system is physically coupled to the first mounting and communication structure.

Abstract: Embodiments of the disclosure provide an electric drive motor system that includes a stationary-side and a rotating-side. The stationary-side includes an only-stationary-side (OSS) compensation network. A first OSS compensation element of the OSS compensation network is operable to provide a rotating-side compensation function.

Abstract: A system is provided for transferring power between a stator and a rotor of an excitation system. The stator and the rotor may form part of a rotary transformer that includes a primary winding and a secondary winding, where power is transferred from the primary winding to the secondary winding or conversely from the secondary winding to the primary winding.

Abstract: The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Abstract: The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.