Abstract: The present invention relates to a process for eliminating low solder ball shear strength in electronic packages and interconnect substrates, and the resulting electronic package or interconnect substrates. In the present invention interconnect substrates are processed to provide a conductive surface contact with a layer of gold that forms a more substantial bond with a solder ball to increase the solder ball shear strength value, especially when the solder ball and corresponding conductive surface contact are electrically coupled to internal power and/or ground planes.