Patents by Inventor Randy Hsu

Randy Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150108038
    Abstract: A new type of tape and reel tape based on the cover tape having projections extending from the bottom surface of the cover tape leaving a minimum of adhesive surface exposed to the surface mount die or packages contained in the pocket areas of the carrier tape.
    Type: Application
    Filed: October 23, 2013
    Publication date: April 23, 2015
    Inventors: Randy Hsu, Shawn Wu, J K Ho, Debby Hsiao
  • Publication number: 20130078768
    Abstract: A nest mechanism includes a 2-dimensional grid of support positions for supporting singulated electronic units. The support positions each include an inner opening and an outer horizontal base around the inner opening having a support surface that supports units thereon. A segmented wall arrangement is on the outer horizontal base located beyond an area of the unit for preventing movement of the unit while on the support surface. The segmented wall arrangement includes (i) a plurality of raised wall segments that extend to a first height above the support surface, and (ii) at least one recessed segment between the plurality of raised wall segments that has a height less than the first height. The recessed segment(s) help liquid-based washing processes to remove residue material generated by a sawing process that can become stuck under the units while in the nest mechanism awaiting transfer.
    Type: Application
    Filed: September 28, 2011
    Publication date: March 28, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: RANDY HSU, CLIFF HO
  • Publication number: 20120223423
    Abstract: A lead frame strip includes an array of sites connected to two side rails which traverse the lead frame strip on two opposite sides. Each site includes a die pad for affixing a semiconductor die and leads for enabling electrical communication between the semiconductor die and a workpiece. Each site is further connected to the two side rails by a sub-rail, which extends between the two side rails. The sub-rail includes a flat portion and a raised or indented rib protruding from the flat portion. The rib has a long dimension parallel to the sub-rail.
    Type: Application
    Filed: March 2, 2011
    Publication date: September 6, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Randy Hsu, Chuen-Shing Liao