Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided.

Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided.

Abstract: A circularly polarized reflect array antenna having a plurality of antenna elements, where each antenna element has an electrically conductive patch, at least two electrically conductive stubs positioned along the periphery of the patch, and at least two switches each operable to connect or disconnect the patch to one of the at least two stubs.

Abstract: A circularly polarized reflect array antenna having a plurality of antenna elements, where each antenna element has an electrically conductive patch, at least two electrically conductive stubs positioned along the periphery of the patch, and at least two switches each operable to connect or disconnect the patch to one of the at least two stubs.

Abstract: A phase shifting array antenna includes antenna elements that have a non-electrically conductive substrate having first and second sides, an electrically conductive patch formed on the first side of the substrate, and a ground plane formed on the second side of the non-electrically conductive substrate. At least two pairs of integrated microelectromechanical switches are arranged diametrically opposed across the patch on the first side of the substrate, each microelectromechanical switch having a first electrode electrically coupled to the patch and a second electrode electrically coupled to the ground plane, the first and second electrodes being operable to be capacitively coupled, thereby creating a short circuit plane across the patch. A sealing structure hermetically packages the microelectromechanical switches.

Abstract: A method of performing a soft hand-off between a first and second satellite traveling on first and second orbiting paths with an one-dimensional active electronically scanned array includes tracking and communicating with a first satellite orbiting in a first orbiting path. A scan plane of the array is then mechanically positioned and aligned so that the scan plane intersects both the first and second orbiting paths of the first and second satellites. The array continues to track and communicate with the first satellite until the first satellite is nearing a predetermined scan limit of the active electronically scanned array. The array is then operated to scan and acquire the second satellite, and establish communications therewith. Tracking and communications with the first satellite is then discontinued.

Abstract: A Rotman lens (12, 13) includes a first insulating layer (26) having a high dielectric constant and a second insulating layer (46) having a low dielectric constant. Metalization provided on the first insulating layer includes a lens portion (28), and metalization provided on the second insulating layer includes a plurality of transmission lines (48) and bootlace lines (52). A plurality of via openings are provided through at least one of the insulating layers, and each contain conductive material (33, 38) which electrically couples the lens portion to a respective one of the transmission lines or bootlace lines. A number of the bootlace lines physically overlap the lens portion, without electrical engagement therewith. A ground plane (63) on a further insulating layer (61) may be provided between the first and second insulating layers, in a manner free of electrical contact with the conductive material in the via openings.

Abstract: A method for forming a transmission line arrangement providing control of signal losses through the use of conductor cross-sectional surface area-increasing and skin effect-considered bulbous additions to the rectangular conductor cross-sectional shape frequently used in semiconductor device transmission line conductors. The achieved transmission line is especially suited for use in radio frequency integrated circuit assemblies where it also includes a backplane member, encounters signals in the microwave and millimeter wavelength range and involves conductor dimensions measured in micrometers. Control of transmission line characteristic impedance at, for example, 50 ohms is disclosed as is use of semiconductor device-compatible materials and loss comparisons data.

Abstract: A circularly polarized reflect array antenna having a plurality of antenna elements, where each antenna element has an electrically conductive patch, at least two electrically conductive stubs positioned along the periphery of the patch, and at least two switches each operable to connect or disconnect the patch to one of the at least two stubs.

Abstract: A transmission line arrangement providing control of signal losses through the use of conductor cross-sectional surface area-increasing and skin effect-considered bulbous additions to the rectangular conductor cross-sectional shape frequently used in semiconductor device transmission line conductors. The achieved transmission line is especially suited for use in radio frequency integrated circuit assemblies where it also includes a backplane member, encounters signals in the microwave and millimeter wavelength range and involves conductor dimensions measured in micrometers. Control of transmission line characteristic impedance at, for example, 50 ohms is disclosed as is use of semiconductor device-compatible materials and loss comparisons data.