Patents by Inventor Randy Kinnison

Randy Kinnison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetic package with improved RF stability and performance
    Patent number: 9780010
    Abstract: The present disclosure relates to a hermetic package with improved RF stability and performance. The package includes a carrier, a bottom dielectric ring over the carrier, a bottom metal layer over the bottom dielectric ring, a top dielectric ring over the bottom metal layer, a top metal layer over the top dielectric ring, an exterior plated layer, and multiple top vias. Herein, the bottom metal layer includes signal sections and at least one ground section, which is electrically isolated from the signal sections. The exterior plated layer covers at least a portion of a first exterior sidewall of the bottom ring structure and electrically couples the carrier to the at least one ground section. The multiple top vias extend through the top dielectric ring and electrically couple the top metal layer to the at least one ground section.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: October 3, 2017
    Assignee: Qorvo US, Inc.
    Inventors: Bo Zhao, Raj Santhakumar, Randy Kinnison
  • HERMETIC PACKAGE WITH IMPROVED RF STABILITY AND PERFORMANCE
    Publication number: 20170278767
    Abstract: The present disclosure relates to a hermetic package with improved RF stability and performance. The package includes a carrier, a bottom dielectric ring over the carrier, a bottom metal layer over the bottom dielectric ring, a top dielectric ring over the bottom metal layer, a top metal layer over the top dielectric ring, an exterior plated layer, and multiple top vias. Herein, the bottom metal layer includes signal sections and at least one ground section, which is electrically isolated from the signal sections. The exterior plated layer covers at least a portion of a first exterior sidewall of the bottom ring structure and electrically couples the carrier to the at least one ground section. The multiple top vias extend through the top dielectric ring and electrically couple the top metal layer to the at least one ground section.
    Type: Application
    Filed: December 14, 2016
    Publication date: September 28, 2017
    Inventors: Bo Zhao, Raj Santhakumar, Randy Kinnison