Patents by Inventor Randy L. Haight

Randy L. Haight has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards
    Patent number: 5473813
    Abstract: A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith.
    Type: Grant
    Filed: September 9, 1994
    Date of Patent: December 12, 1995
    Assignee: International Business Machines Corporation
    Inventors: Ivan I. Chobot, John A. Covert, Randy L. Haight, Keith D. Mansfield, Donald W. Miller, Reinaldo A. Neira, Alexander Petrovich, Paul C. Sviedrys, Louise A. Tiemann, Gerald A. Valenta, Thurston B. Youngs, Jr.
  • Printed circuit board or card thermal mass design
    Patent number: 5363280
    Abstract: A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.
    Type: Grant
    Filed: April 22, 1993
    Date of Patent: November 8, 1994
    Assignee: International Business Machines Corporation
    Inventors: Ivan I. Chobot, John A. Covert, Randy L. Haight, Keith D. Mansfield, Donald W. Miller, Reinaldo A. Neira, Alexander Petrovich, Paul C. Sviedrys, Louise A. Tiemann, Gerald A. Valenta, Thurston B. Youngs, Jr.