Patents by Inventor Randy L. Pollock

Randy L. Pollock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making a semiconductor device with diamond heat dissipation layer
    Patent number: 5508230
    Abstract: A semiconductor device having improved heat dissipating capability is provided. The preferred device in accordance with the invention includes an electronic device (12) formed in a surface (14) of a semiconductor die (10). The surface (14) is covered with a layer of diamond (20). Openings (24) are provided in the diamond layer (20) for access to the electronic device. A metallized pad (26) is provided on top of the diamond layer (20). Additionally, solder bumps (28) pass through the openings (24) in the diamond layer (20). A die attach substrate (32) is attached to the metallized pad (26) and the bumps (28). Heat is dissipated uniformly across the diamond layer (20) and is drawn off the device through the metallized pad (26). Electrical connections are made to the device via the solder bumps (28).
    Type: Grant
    Filed: April 4, 1995
    Date of Patent: April 16, 1996
    Assignee: Motorola, Inc.
    Inventors: George F. Anderson, Randy L. Pollock
  • Electronic circuit assembly with improved heatsinking
    Patent number: 5388027
    Abstract: An electronic circuit assembly with improved heatsinking is provided. The assembly includes a component carrying board (56) which has an opening (62) through it. The opening is sized to receive a heat generating electronic component (64). A diamond layer (50) is attached as a heat sink to the bottom (58) of the component carrying board. The heat generating component (64) is attached directly to the diamond layer (50), through the opening (62) in the component carrying board (56). The diamond layer provides electrical insulation as well as superior heat dissipation.
    Type: Grant
    Filed: July 29, 1993
    Date of Patent: February 7, 1995
    Assignee: Motorola, Inc.
    Inventors: Randy L. Pollock, George F. Anderson, Jr.
  • Method for making a substrate structure with improved heat dissipation
    Patent number: 5354717
    Abstract: A method for making a substrate structure with improved heat dissipation is provided. A semiconductor wafer (14) is provided. A diamond layer (12) is formed on the back (20) of the wafer (14). The diamond layer (12) provides structural support and heat dissipation. In certain embodiments, the diamond layer may be an amorphous diamond substrate ( 12 ) bonded to the semiconductor wafer (14), In certain other embodiments the diamond layer (12) may be a thin film layer (12) deposited on the back of the semiconductor wafer (14). The semiconductor wafer (14) is thinned to a minimum thickness necessary for forming an electronic device in a surface (22) of the wafer (14).
    Type: Grant
    Filed: July 29, 1993
    Date of Patent: October 11, 1994
    Assignee: Motorola, Inc.
    Inventors: Randy L. Pollock, George F. Anderson, Jr.