Patents by Inventor Randy Lee Smith

Randy Lee Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Room temperature curable water-based mold release agent for composite materials
    Patent number: 7705086
    Abstract: A room temperature curable water-based mold release agent that is useful for demolding composite parts, such as epoxy and polyester based polymer materials. The mold release agent is curable at low temperatures, such as room temperature, but is thermally stable up to conventional epoxy based composite molding temperatures, e.g., greater than 200 or 280° C. The mold release agent is useful for demolding large composite parts that are cured in large ovens at high temperature when the molds themselves are prepped at room temperature before placing in the oven. The mold release agent is also useful for demolding polyester composite parts that are prepared and cured at low temperature such as room temperature.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: April 27, 2010
    Assignee: Henkel Corporation
    Inventors: Zheng Lu, Randy Lee Smith
  • Low VOC-solvent based mold release agent and curable mold release compositions based thereon
    Patent number: 7462668
    Abstract: The present invention relates to curable mold release compositions containing a non-volatile organic (non-VOC), or low-volatile organic (low-VOC), component employed as a carrier for a curable component. When applied as a coating the mold release compositions cure to a finish having a high durability that is sustained throughout multiple releases.
    Type: Grant
    Filed: July 20, 2004
    Date of Patent: December 9, 2008
    Assignee: Henkel Corporation
    Inventors: Zheng Lu, Randy Lee Smith, Tamara Lynn Harmar, Daniel I. Shaw