Abstract: Monitoring for thermal events in a vehicle may be provided while the vehicle is in a sleep mode. The monitoring may be performed by periodically switching one of several processing cores of an electrical control unit (ECU) of the vehicle to a run or wake state to obtain and analyze sensor data. A duty cycle for the periodic wakeups of the one of the several processing cores may be determined based on a balancing of an amount of time for sensing and analyzing the sensor data, a time corresponding to a characteristic feature of a thermal event, and/or a power constraint associated with the sleep mode of the vehicle.

Abstract: A PCB has a plurality of peripheral controllers mounted to the PCB, each peripheral controller including one or more registers. A bus is secured to the PCB and including one or more data lines each data line of the one or more data lines coupled to each peripheral controllers of the plurality of peripheral controllers. A memory is mounted to the PCB. A microcontroller is mounted to the PCB and coupled to the memory and the bus. The microcontroller configured to transmit and receive data to each peripheral controller of the plurality of peripheral controllers according to a static schedule in which for each cycle of the static schedule, each time window of a plurality of time windows is statically dedicated to exchange of data with each peripheral controller of the plurality of peripheral controllers corresponding to each time window.

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

Abstract: In accordance with the teachings of the present disclosure, methods and apparatus are provided for a semiconductor device having thin anti-reflective layer(s) operable to absorb radiation that may otherwise reflect off surfaces disposed inwardly from the anti-reflective layer(s). In a method embodiment, a method for manufacturing a semiconductor device includes forming a support structure outwardly from a substrate. The support structure has a first thickness and a first outer sidewall surface that is not parallel with the substrate. The first outer sidewall surface has a first minimum refractive index. The method further includes forming an anti-reflective layer outwardly from the first outer sidewall surface. The anti-reflective layer has: a second outer sidewall surface that is not parallel with the substrate, a second refractive index that is greater than the first minimum refractive index, and a second thickness that is less than the first thickness.

Abstract: In accordance with the teachings of the present disclosure, methods and apparatus are provided for a semiconductor device having thin anti-reflective layer(s) operable to absorb radiation that may otherwise reflect off surfaces disposed inwardly from the anti-reflective layer(s). In a method embodiment, a method for manufacturing a semiconductor device includes forming a support structure outwardly from a substrate. The support structure has a first thickness and a first outer sidewall surface that is not parallel with the substrate. The first outer sidewall surface has a first minimum refractive index. The method further includes forming an anti-reflective layer outwardly from the first outer sidewall surface. The anti-reflective layer has: a second outer sidewall surface that is not parallel with the substrate, a second refractive index that is greater than the first minimum refractive index, and a second thickness that is less than the first thickness.

Abstract: In apparatus for the formation of a planar blank into a flanged container, vertically reciprocating breaker rods for engagement with peripheral edge panels of the blank for a downward breaking of the edge panels over fixed breaker blocks prior to an inward folding of the container walls. Horizontally reciprocating glue applicators deposit glue on the downwardly broken edge panels at portions thereof overlapping as the container is formed. The formed containers are sequentially fed into a forming chamber incorporating serrated wall-defining inner vertical surfaces which engage the flanges and retain the containers for progressive downward feeding. Vertically reciprocating setter bars engage and downwardly deflect the flanges of the chamber-received containers.