Patents by Inventor Randy M. Yim

Randy M. Yim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Simplified hole interconnect process
    Patent number: 5869395
    Abstract: The subject invention is directed to a method for producing semiconductor wafers using a simplified hole interconnect process. These wafers include at least one interconnect layer located on a contact or via layer. As contrasted with the semiconductor wafers produced according to the prior art method described above, the contact or via layer of this invention includes a plurality of patterned openings formed therein which are in substantial alignment without offset with each other.
    Type: Grant
    Filed: January 22, 1997
    Date of Patent: February 9, 1999
    Assignee: LSI Logic Corporation
    Inventor: Randy M. Yim