Abstract: A system may include an integrated circuit die defining a plurality of inner apertures, and a conductive element disposed on two or more of the plurality of inner apertures and electrically connected to an electrical conductor through the two or more inner apertures. In some embodiments, the integrated circuit die defines a plurality of peripheral apertures and also includes a conductive pillar disposed on one of the plurality of peripheral apertures and electrically connected to a second electrical conductor through the peripheral aperture.

Abstract: A method and apparatus for making pad structures suitable for wirebonding and, optionally, also for solder-ball connections. Some embodiments include an electronics chip having a substrate with circuitry, a compliant electrically insulating layer deposited on at least a portion of the substrate, and an electrical connection pad, the pad having an electrical connection to the circuitry through an aperture in the insulating layer and a peripheral bonding zone region extending over the insulating layer. In some embodiments, the bonding zone is exclusively over the insulating layer outside of the aperture. In some embodiments, the pads are suitable for both solder-ball and wirebond connections. By making a wirebond connection to an area of a pad over the compliant insulating layer, the underlying circuitry is protected from ultrasonic energy of the bonding process.

Abstract: A method of separating a plurality of micro-devices from one another which are formed in a predetermined pattern on a single substrate is disclosed herein. Each micro-device includes at least one predetermined area to be protected from process debris during the separating process. The method includes the step of first coating the micro-devices with a water soluble material such that at least the predetermined area is covered. Following coating, the micro-devices are separated from one another such that the water soluble material continues to cover the predetermined area. Next, the micro-devices and the water soluble material are exposed to water which substantially removes the water soluble material from the predetermined area without harming the micro-devices such that contamination of the predetermined area by the process debris is prevented during the separating step.

Abstract: In the preparation of copper parts for the tape automated bonding of semiconductor devices, the copper parts are subjected to a mild organic acid. This treatment etches the copper, removes contaminants and passivates the surfaces so that subsequent oxidation is retarded. In the case where the copper parts are the bumps on a semiconductor wafer selective etching is avoided.

Abstract: A method for solder plating metal leads in plastic semiconductor packages comprises cleaning the leads followed by electroplating tin or a tin/lead alloy onto the leads. The cleaning is effected with a non-corrosive solution which is either a carboxylic acid, a hydroxycarboxylic acid, or a combination of both. The electroplating solution is a sulfonic acid or citric acid based system, including suitable tin salts and/or lead salts. A sequestering agent may be used to inhibit the corrosive effect of the electroplating bath.