Patents by Inventor Ranjeet Balakrishna Rao

Ranjeet Balakrishna Rao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Co-extruded microchannel heat pipes
    Patent number: 10371468
    Abstract: A microchannel heat pipe formed on a substrate surface using co-extruding a primary material and a secondary material such that the primary material forms side wall portions that are spaced apart by the secondary material, and an upper wall portion is formed across the upper ends of the side walls to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: August 6, 2019
    Assignee: Palo Alto Research Center Incorporated
    Inventors: David Eric Schwartz, Ranjeet Balakrishna Rao
  • Co-extruded microchannel heat pipes
    Patent number: 10160071
    Abstract: A method for generating a microchannel heat pipe on a substrate surface includes co-extruding a primary material and a secondary material such that the primary material forms side walls that are spaced apart by the secondary material to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body structure having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid. The co-extrusion process is modified such that the side and upper walls are self-formed either while flowing inside a co-extrusion printhead, or immediately upon exiting the printhead.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: December 25, 2018
    Assignee: Palo Alto Research Center Incorporated
    Inventors: David Eric Schwartz, Ranjeet Balakrishna Rao
  • Co-Extruded Microchannel Heat Pipes
    Publication number: 20150367462
    Abstract: A method for generating a microchannel heat pipe on a substrate surface includes co-extruding a primary material and a secondary material such that the primary material forms side walls that are spaced apart by the secondary material to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body structure having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid. The co-extrusion process is modified such that the side and upper walls are self-formed either while flowing inside a co-extrusion printhead, or immediately upon exiting the printhead.
    Type: Application
    Filed: July 30, 2015
    Publication date: December 24, 2015
    Inventors: David Eric Schwartz, Ranjeet Balakrishna Rao
  • Co-extruded microchannel heat pipes
    Patent number: 9120190
    Abstract: A method for generating a microchannel heat pipe on a substrate surface includes co-extruding a primary material and a secondary material such that the primary material forms side walls that are spaced apart by the secondary material to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body structure having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 1, 2015
    Assignee: Palo Alto Research Center Incorporated
    Inventors: David Eric Schwartz, Ranjeet Balakrishna Rao
  • Co-Extruded Microchannel Heat Pipes
    Publication number: 20130133201
    Abstract: A method for generating a microchannel heat pipe on a substrate surface includes co-extruding a primary material and a secondary material such that the primary material forms side walls that are spaced apart by the secondary material to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body structure having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.
    Type: Application
    Filed: November 30, 2011
    Publication date: May 30, 2013
    Applicant: Palo Alto Research Center Incorporated
    Inventors: David Eric Schwartz, Ranjeet Balakrishna Rao
  • Co-Extruded Microchannel Heat Pipes
    Publication number: 20130133863
    Abstract: A microchannel heat pipe formed on a substrate surface using co-extruding a primary material and a secondary material such that the primary material forms side wall portions that are spaced apart by the secondary material, and an upper wall portion is formed across the upper ends of the side walls to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.
    Type: Application
    Filed: November 30, 2011
    Publication date: May 30, 2013
    Applicant: Palo Alto Research Center Incorporated
    Inventors: David Eric Schwartz, Ranjeet Balakrishna Rao