Abstract: Techniques are described for a method for detecting a fault. The method includes receiving, by a receiving electronic device, via a differential pair transmission line, from a transmitting electronic device, an electrical signal. The method further includes converting, by a receiving (Rx) serializer/deserializer (SerDes) operating at the receiving electronic device, the received electrical signal into a received digital electrical signal. The method further includes, determining, by one or more processors, an electrical signature of the received electrical signal from the received digital electrical signal when the received electrical signal is received by the receiving electronic device. The method further includes determining, by the one or more processors, based on the electrical signature, a position of a fault between the receiving electronic device and the transmitting electronic device. The fault causes the received electrical signal to be different than the transmitted electrical signal.

Abstract: A printed circuit board (PCB) assembly may include a component capable of sending or receiving high-speed differential signal pairs, a package that is connected to the component, and a PCB connected to the package. The PCB assembly may be used to support a first high-speed differential signal pair that includes a first differential signal and a second differential signal. The first differential signal may be capable of causing crosstalk onto a particular differential signal, of a second high-speed differential signal pair, while propagating through the PCB assembly. A set of interconnects may be used to intelligently route the first differential signal pair within the package and/or within the PCB. The set of interconnects may include a first interconnect to route the first differential signal away from the particular differential signal and a second interconnect to route the second differential signal toward the particular differential signal.

Abstract: In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a first trace via on a first layer and a second trace electrically connected to a second pad of a second trace via on a second layer. In some examples, the PCB device also includes four ground pads on the first layer and an antipad surrounding the two trace vias, where a first ground pad is positioned between the first trace and the second trace, where the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad, and wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad.

Abstract: Techniques are described for a method for detecting a fault. The method includes receiving, by a receiving electronic device, via a differential pair transmission line, from a transmitting electronic device, an electrical signal. The method further includes converting, by a receiving (Rx) serializer/deserializer (SerDes) operating at the receiving electronic device, the received electrical signal into a received digital electrical signal. The method further includes, determining, by one or more processors, an electrical signature of the received electrical signal from the received digital electrical signal when the received electrical signal is received by the receiving electronic device. The method further includes determining, by the one or more processors, based on the electrical signature, a position of a fault between the receiving electronic device and the transmitting electronic device. The fault causes the received electrical signal to be different than the transmitted electrical signal.

Abstract: In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a first trace via on a first layer and a second trace electrically connected to a second pad of a second trace via on a second layer. In some examples, the PCB device also includes four ground pads on the first layer and an antipad surrounding the two trace vias, where a first ground pad is positioned between the first trace and the second trace, where the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad, and wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad.