Patents by Inventor Ranjit R. Patil

Ranjit R. Patil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7368814
    Abstract: An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e.g., having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package) and providing an interconnect device. Interconnect elements extend through a substrate of the interconnect device and are electrically connected to conductive pads on a second side of the high density interconnect board.
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: May 6, 2008
    Assignee: Ironwood Electronics, Inc.
    Inventors: Michael J. Tully, Ranjit R. Patil