Patents by Inventor Ranjith Ranganathan

Ranjith Ranganathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10503948
    Abstract: Systems and methods for multi-spectral ultrasonic imaging are disclosed. In one embodiment, a finger is scanned at a plurality of ultrasonic scan frequencies. Each scan frequency provides an image information set describing a plurality of pixels of the finger including a signal-strength indicating an amount of energy reflected from a surface of a platen on which a finger is provided. For each of the pixels, the pixel output value corresponding to each of the scan frequencies is combined to produce a combined pixel out put value for each pixel. Systems and methods for improving the data capture of multi-spectral ultrasonic imaging are also disclosed.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: December 10, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Jack Conway Kitchens, II, John Keith Schneider, Ashish Hinger, Ranjith Ranganathan, Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, David William Burns, Nao Sugawara Chuei, Eliza Yingzi Du, Ming Yu Chen, Kwokleung Chan, Jin Gu, Esra Vural
  • Patent number: 10274590
    Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: April 30, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei, Ashish Hinger, David William Burns
  • Publication number: 20180031686
    Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
    Type: Application
    Filed: October 12, 2017
    Publication date: February 1, 2018
    Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei, Ashish Hinger, David William Burns
  • Patent number: 9817108
    Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: November 14, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei
  • Publication number: 20160350573
    Abstract: Systems and methods for multi-spectral ultrasonic imaging are disclosed. In one embodiment, a finger is scanned at a plurality of ultrasonic scan frequencies. Each scan frequency provides an image information set describing a plurality of pixels of the finger including a signal-strength indicating an amount of energy reflected from a surface of a platen on which a finger is provided. For each of the pixels, the pixel output value corresponding to each of the scan frequencies is combined to produce a combined pixel out put value for each pixel. Systems and methods for improving the data capture of multi-spectral ultrasonic imaging are also disclosed.
    Type: Application
    Filed: March 5, 2015
    Publication date: December 1, 2016
    Applicant: Qualcomm Incorporated
    Inventors: Jack Conway Kitchens, II, John Keith Schneider, Ashish Hinger, Ranjith Ranganathan, Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, David William Burns, Nao Sugawara Chuei, Eliza Yingzi Du, Ming Yu Chen, Kwokleung Chan, Jin Gu, Esra Vural
  • Publication number: 20150198699
    Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
    Type: Application
    Filed: January 5, 2015
    Publication date: July 16, 2015
    Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei