Patents by Inventor Ranjith Ranganathan
Ranjith Ranganathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10503948Abstract: Systems and methods for multi-spectral ultrasonic imaging are disclosed. In one embodiment, a finger is scanned at a plurality of ultrasonic scan frequencies. Each scan frequency provides an image information set describing a plurality of pixels of the finger including a signal-strength indicating an amount of energy reflected from a surface of a platen on which a finger is provided. For each of the pixels, the pixel output value corresponding to each of the scan frequencies is combined to produce a combined pixel out put value for each pixel. Systems and methods for improving the data capture of multi-spectral ultrasonic imaging are also disclosed.Type: GrantFiled: March 5, 2015Date of Patent: December 10, 2019Assignee: QUALCOMM IncorporatedInventors: Jack Conway Kitchens, II, John Keith Schneider, Ashish Hinger, Ranjith Ranganathan, Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, David William Burns, Nao Sugawara Chuei, Eliza Yingzi Du, Ming Yu Chen, Kwokleung Chan, Jin Gu, Esra Vural
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Patent number: 10274590Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.Type: GrantFiled: October 12, 2017Date of Patent: April 30, 2019Assignee: QUALCOMM IncorporatedInventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei, Ashish Hinger, David William Burns
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Publication number: 20180031686Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.Type: ApplicationFiled: October 12, 2017Publication date: February 1, 2018Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei, Ashish Hinger, David William Burns
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Patent number: 9817108Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.Type: GrantFiled: January 5, 2015Date of Patent: November 14, 2017Assignee: QUALCOMM IncorporatedInventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei
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Publication number: 20160350573Abstract: Systems and methods for multi-spectral ultrasonic imaging are disclosed. In one embodiment, a finger is scanned at a plurality of ultrasonic scan frequencies. Each scan frequency provides an image information set describing a plurality of pixels of the finger including a signal-strength indicating an amount of energy reflected from a surface of a platen on which a finger is provided. For each of the pixels, the pixel output value corresponding to each of the scan frequencies is combined to produce a combined pixel out put value for each pixel. Systems and methods for improving the data capture of multi-spectral ultrasonic imaging are also disclosed.Type: ApplicationFiled: March 5, 2015Publication date: December 1, 2016Applicant: Qualcomm IncorporatedInventors: Jack Conway Kitchens, II, John Keith Schneider, Ashish Hinger, Ranjith Ranganathan, Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, David William Burns, Nao Sugawara Chuei, Eliza Yingzi Du, Ming Yu Chen, Kwokleung Chan, Jin Gu, Esra Vural
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Publication number: 20150198699Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.Type: ApplicationFiled: January 5, 2015Publication date: July 16, 2015Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei