Patents by Inventor Ranjith Samuel E. John

Ranjith Samuel E. John has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive micro LED architecture for on-wafer testing
    Patent number: 11404601
    Abstract: LED donor substrates and conductive architectures for on-wafer testing are described. In an embodiment, an array of LEDs is supported by an array of electrically conductive stabilization posts. The electrically conductive stabilization posts can be coupled with a test pad for on-wafer testing prior to transferring the LEDs to a receiving substrate.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: August 2, 2022
    Assignee: Apple Inc.
    Inventors: Ranjith Samuel E. John, Adam C. Abrahamsen, Clayton K. Chan, Madhan M. Raj, Michael Y. Chan, Nazneen N. Jeewakhan, Yu S. Yang
  • Conductive Micro LED Architecture for On-Wafer Testing
    Publication number: 20210091259
    Abstract: LED donor substrates and conductive architectures for on-wafer testing are described. In an embodiment, an array of LEDs is supported by an array of electrically conductive stabilization posts. The electrically conductive stabilization posts can be coupled with a test pad for on-wafer testing prior to transferring the LEDs to a receiving substrate.
    Type: Application
    Filed: June 23, 2020
    Publication date: March 25, 2021
    Inventors: Ranjith Samuel E. John, Adam C. Abrahamsen, Clayton K. Chan, Madhan M. Raj, Michael Y. Chan, Nazneen N. Jeewakhan, Yu S. Yang
  • Surface modification process for laser application
    Patent number: 9966260
    Abstract: Laser lift-off methods are described in which optical flatness is provided on the back side of a temporary substrate using either an optical layer or optical liquid. A laser is directed through the optical layer or optical liquid and a back side of the temporary substrate to decompose a portion of a process layer supported on a front side of the temporary substrate, followed by separation of the process layer and the temporary substrate.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: May 8, 2018
    Assignee: APPLE INC.
    Inventors: Clayton Ka Tsun Chan, Ion Bita, Ranjith Samuel E. John, Alfred F. Renaldo, Jie Fu, Sudirukkuge T. Jinasundera, An-Chun Tien