Abstract: The invention comprises a butyl acetate-silicone formulation comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and a coating effective amount of (D) butyl acetate. The invention also comprises related silicone formulations made by removing a portion, or all, of (D) butyl acetate therefrom, and related cured products, methods, articles and devices.

Abstract: Methods for fabrication of thermal interposers, using a low stress photopatternable silicone are provided, for use in production of electronic products that feed into packaging of LEDs, logic and memory devices and other such semiconductor products where thermal management is desired. A photopatternable silicone composition, thermally conductive material and a low melting point compliant solder form a complete semiconductor package module. The photopatternable silicone is applied on a surface of a wafer and selectively radiated to form openings which provided user defined bondline thickness control. The openings are then filled with high conductivity pastes to form high conductivity thermal links. A low melting point curable solder is then applied where the solder wets the silicone as well as the thermally conductive path that leads to low thermal contact resistance between the structured z-axis thermal interposer and the heat sink and/or substrate which can be a wafer or PCB.

Abstract: A method for preparing an article includes applying a first composition on a substrate to form a first layer, and applying a curing condition to a target portion without applying the curing condition to a non-target portion of the first layer to form a first contrast layer. A second composition is then applied on the first contrast layer to form a second layer, and a curing condition is applied to a target portion without applying the curing condition to a non-target portion of the second layer and first contrast layer to form a second contrast layer. A third composition can optionally be applied and cured on the second contrast layer to form a third contrast layer having a cured and uncured portion in the same manner. The uncured portions of these contrast layers are then selectively removed to prepare the article.