Patents by Inventor Raph PIETERS

Raph PIETERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9449877
    Abstract: A method of singulating a semiconductor wafer with laser energy while the semiconductor wafer is supported on a mounting tape during singulation comprises the step of depositing a coating material onto a portion of the mounting tape adjacent to a perimeter of the semiconductor wafer to form a protective layer over the mounting tape. The semiconductor wafer is then cut with a laser beam such that the laser beam at least partially impinges upon the protective layer during cutting of the semiconductor wafer. After singulation of the semiconductor wafer, the protective layer is removed from the mounting tape.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: September 20, 2016
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Frank Ernst, Rogier Evertsen, Raph Pieters, Mark Müller, Guido Knippels
  • Publication number: 20160079118
    Abstract: A method of singulating a semiconductor wafer with laser energy while the semiconductor wafer is supported on a mounting tape during singulation comprises the step of depositing a coating material onto a portion of the mounting tape adjacent to a perimeter of the semiconductor wafer to form a protective layer over the mounting tape. The semiconductor wafer is then cut with a laser beam such that the laser beam at least partially impinges upon the protective layer during cutting of the semiconductor wafer. After singulation of the semiconductor wafer, the protective layer is removed from the mounting tape.
    Type: Application
    Filed: September 17, 2014
    Publication date: March 17, 2016
    Inventors: Frank ERNST, Rogier EVERTSEN, Raph PIETERS, Mark Müller, Guido KNIPPELS